Spelling suggestions: "subject:"epoxy resins. microelectronic packaging."" "subject:"epoxy resins. microelectronics packaging.""
1 |
Cure behavior of epoxy polymers used in microelectronics /Taweeplengsangsuke, Jantrawan, January 2000 (has links)
Thesis (Ph. D.)--Lehigh University, 2000. / Includes vita. Includes bibliographical references (leaves 220-231).
|
Page generated in 0.0914 seconds