Failure mechanisms observed in electromigration (EM) stressed dual damascene Cu/SiO₂ interconnects trees were studied and simulated. Failure sites with ‘melt patch’ or ‘crater’ are common for test structures in the top metal layer, though the occurrence of such failure modes probably depends on the passivation layer thickness. Interconnects that were EM stressed for a short time and then stressed with increasing current to induce Joule heating in the line had similar failure sites to lines that were stressed to failure under standard EM conditions. This shows that some failure mechanisms during EM could be assisted by Joule heating effect. / Singapore-MIT Alliance (SMA)

With increasing demands in bone repair and replacement, this research investigates the microstructure, properties and performance of bovine bone, human bone, and synthetic materials. Doing so, experimental approaches were used to exam and compare bones, as well as mimicking nature by developing a synthetic material to repair bones. Experimentally, bovine bone, tumor-free human bone, and cancerous human bone were studied via the small scale mechanical loading test. Failure analysis was conducted via optical and electronic microscopic techniques. Characterization results were used to develop a synthetic material that possesses strength and strain needed as a bone material. Characterizing techniques include a small punch test, scanning electron microscope (SEM), optical microscope and x-ray diffraction (XRD) were used for experimental approach. The results showed that small punch tests in longitudinal and tangential directions showed different mechanical properties and failure mechanisms. Cancer cells in human bone caused the bone softening and lowered the density. Synthesized epoxy-silicone-geopolymer material had higher deformability than bone. Understanding obtained in this research helps us to develop better synthetic bone materials in future. This thesis is composed of six chapters. The first chapter covers as an introduction to understand the purpose and motivation of present studies, and this section followed by the details of the motivation and objectives of this research. The third chapter explains experimental approaches that were conducted to meet the objectives. The fourth chapter describes the results and the major discovery of the experiments, and the results will be discussed in the Chapter IV. Finally, the last chapter provides the conclusions and recommendations for future work.

[pt] Durante a fase produtiva de um poço de petróleo ou gás, muitas vezes há a produção simultânea de partículas sólidas arrancadas da matriz da rocha reservatório. Este fenômeno recebe o nome de produção de areia. Neste caso as tensões e as condições de fluxo nas vizinhanças do poço são fatores fundamentais para a deflagração do processo. As tensões que se concentram na parede do poço com a perfuração do mesmo, pode ser de tal magnitude que pode causar a perda da coesão entre os grãos e criando , assim , uma região de material granular susceptível ao arraste pelas forças de percolação derivadas do fluxo. Este trabalho visou a realização de ensaios em amostras de arenito Rio Bonito e arenito sintético utilizando a técnica da Tomografia Computadorizada de Raios-X para acompanhamento em tempo real dos ensaios. Os ensaios tiveram por objetivo identificar a pressão de início e o modo de propagação da ruptura da parede da cavidade interna da amostra ensaiada. Estes são estágios iniciais dos processos de produção de areia em rochas. As análises das imagens tomográficas adquiridas durante os ensaios permitiram a visualização de breakouts e arrombamentos dos poços. Estudos mais detalhados possibilitaram estimar a quantidade de areia produzida e reconstruir tridimensionalmente o processo de propagação da ruptura. / [en] During productive phase of the well, manytimes there is simultaneous production of the solid particles detached from matrix of the reservoir rock. This phenomenon receive the name of the sand production. In this case stress and flow conditions around of the well are fundamental factors for deflagration of the process. Stress concentration in the wall of the well lead to the loss of cohesion between grains arising, consequently, a granular material region susceptible for dragging by seepage forces derived from fluid flow. The objective of this work was to perform sand production tests in Rio Bonito and synthetic sandstone samples using real-time X-Ray Computerized Tomography. The tests investigated the initial and the evolution of failure at the cavity wall of samples. These are initial stages of the sand production process. The analysis of the CT-scans obtained during tests allowed the visualization of breakouts and collapses of the wells. From studies more details were possible estimate the sand production and produce 3-D images of the propagation of the failure.

This thesis deals with the reliability and life-time ofelectronic components and ways to determine these factors.Plastic encapsulated and open test circuits were assessed atdifferent humidity and temperature conditions. From the resultsan acceleration factor could be derived using the Arrheniusrelation. This factor is used to determine failure rates atdifferent drift conditions under accelerated test conditions. Aformula for the factor containing both relative humidity andtemperature could be established and was found to hold also formeasurements published by others. Electrostatic discharge (ESD) transients were studiedexperimentally and by simulation with good agreement. A verysensitive method to detect latent failures of two kinds wasintroduced by nonlinearity measurements utilizing the thirdharmonic of a test signal. The ESD-susceptibility dependence ondesign and technology is shown and can be used to improvebuilt-in reliability. Influences in the performance of semiconductor devices fromdefects like fixed charges and ions were interpreted for thefirst time by simulation using a 2D- finite element componentprogram. Significant results gave an application to a MOSFETdevice showing parameter derating, especially the change of thethreshold value. A short description of later development insimulation methods with new, more powerful tools improvingcomponent performance and reliability is given. Charged thin films of Teflon, so calledelectrets, are used as microphone membranes. Theelectret voltage is a suitable reliability factor. Fromexperimental results a mathematical relation including thetemperature was established for the rate of decay of theelectret voltage with time. A method to charge the electretswith radioactive sources is outlined and described in apatent. Finally an attempt was done to analyze the reliability ofthin film circuits by mathematical methods. Bell LabsintroducedRC-feedback filters realized in tantalum thin filmtechnology. The phase shift of the filter is about π or180°. A mathematical apparatus was developed to calculatethe change in frequency and attenuation from small componentvariations in resistors and capacitors. First and higher ordercorrections were derived, using expansion by the Taylor seriesfor the higher order. <b>Keywords:</b>reliability, failure mechanism, accelerationtests, ESD, latent failure, plastic encapsulation, electret,thin film

The objective of this research is to advance the field of condition monitoring of electrolytic capacitors used in power electronics circuits. The construction process of an electrolytic capacitor is presented. Descriptions of various kinds of faults that can occur in an electrolytic capacitor are discussed. The methods available to detect electrolytic capacitor faults are discussed. The effects of the capacitor faults on the capacitor voltage and current waveforms are investigated through experiments. It is also experimentally demonstrated that faults in the capacitor can be detected by monitoring the capacitor voltage and current. Various ESR estimation based detection techniques available to detect capacitor failures in power electronics circuits are reviewed. Three algorithms are proposed to track and detect capacitor failures: an FFT based algorithm, a system modeling based detection scheme, and finally a parameter estimation based algorithm. The parameter estimation based algorithm is a low-cost real-time scheme, and it is inexpensive to implement. Finally, a detailed study is carried out to understand the failure mechanism of an electrolytic capacitor due to inrush current.

The failure mechanisms of the tantalum-based nitride diffusion barrier using between copper metal and the SiGe/Si layers grown with UHV/CVD have been studied. The TaN and Cu films were deposited with RF sputtering technique. The structure of these films was analyzed by X-ray diffraction. The stoichiometry of TaN was characterized by XPS (X-ray photoelectron spectroscopy). The morphology of the films was examined with SEM and the microstructure of the interface between several layers was observed with TEM. With comparing the XRD patterns of the samples which were annealed in the different temperatures, the failure temperature of the TaN barrier layer can be identified and the failure mechanism of this barrier layer cab be elucidated with TEM observation. The results revealed that the deposited TaN film with low sputtering power had better performance for preventing the Cu atoms diffusing into the SiGe layer. The high composition of Ge in the SiGe alloy degraded the blocking ability of the TaN barrier layer due to the released the existed strain between the SiGe and Si. When the failure temperature was reached, The Cu3Si phase was formed first in the interface of the TaN/SiGe and inside the TaN film. If the annealed temperature went higher, the TaSi2 phase also was formed. Compared with SiGe/Si and Si substrate, the TaN diffusion barrier layer has a higher failure temperature in Si than those in SiGe layer.

<p>This thesis deals with the reliability and life-time ofelectronic components and ways to determine these factors.Plastic encapsulated and open test circuits were assessed atdifferent humidity and temperature conditions. From the resultsan acceleration factor could be derived using the Arrheniusrelation. This factor is used to determine failure rates atdifferent drift conditions under accelerated test conditions. Aformula for the factor containing both relative humidity andtemperature could be established and was found to hold also formeasurements published by others.</p><p>Electrostatic discharge (ESD) transients were studiedexperimentally and by simulation with good agreement. A verysensitive method to detect latent failures of two kinds wasintroduced by nonlinearity measurements utilizing the thirdharmonic of a test signal. The ESD-susceptibility dependence ondesign and technology is shown and can be used to improvebuilt-in reliability.</p><p>Influences in the performance of semiconductor devices fromdefects like fixed charges and ions were interpreted for thefirst time by simulation using a 2D- finite element componentprogram. Significant results gave an application to a MOSFETdevice showing parameter derating, especially the change of thethreshold value. A short description of later development insimulation methods with new, more powerful tools improvingcomponent performance and reliability is given.</p><p>Charged thin films of Teflon, so called<i>electrets</i>, are used as microphone membranes. Theelectret voltage is a suitable reliability factor. Fromexperimental results a mathematical relation including thetemperature was established for the rate of decay of theelectret voltage with time. A method to charge the electretswith radioactive sources is outlined and described in apatent.</p><p>Finally an attempt was done to analyze the reliability ofthin film circuits by mathematical methods. Bell Labsintroduced<i>RC</i>-feedback filters realized in tantalum thin filmtechnology. The phase shift of the filter is about π or180°. A mathematical apparatus was developed to calculatethe change in frequency and attenuation from small componentvariations in resistors and capacitors. First and higher ordercorrections were derived, using expansion by the Taylor seriesfor the higher order.</p><p><b>Keywords:</b>reliability, failure mechanism, accelerationtests, ESD, latent failure, plastic encapsulation, electret,thin film</p>

Consideration of the reinforced concrete beam as a composite beam with incomplete interaction, the effect of principal strains in the shear span is studied. The influence of bond slip on the formation of cracks is studied both analytically and experimentally. / Thesis / Master of Engineering (ME)

Failure mechanisms in large scale open pit slopes are more complex than could be considered through conventional slope design methods. Pit slope behaviour must be predicted accurately, because for very deep open pits, a small change of slope angle can have serious technical and economic consequences. Failure of hard rock slopes often involves both failure along naturally existing weakness planes and failure of intact rock. Without an advanced understanding of combined rock slope failure mechanisms, the validity of commonly applied methods of large scale slope analysis is questionable. The problem was investigated by means of a toolbox approach, in which a wide range of slope stability analysis methods were used and compared to address specific problems arising during slope design optimisation of the Cadia Hill Open Pit, NSW. In particular, numerical modelling is an advanced tool to obtain insight into potential failure mechanisms and to assist the slope design process. The distinct element method was employed to simulate complex rock slope failure, including fracture extension, progressive step-path failure and brittle failure propagation, which were previously often considered unimportant or too difficult to model. A new, failure-scale-dependent concept for the categorisation of slope failures with six categories ranging from 0 (stable) to 5 (overall slope failure) was suggested to assist risk-based slope design. Parametric slope modelling was conducted to determine the interrelationship between proposed categories and critical slope/discontinuity parameters. Initiation and progression of complex slope failure were simulated and described, which resulted in an advanced understanding of combined slope failure mechanisms and the important role of rock bridges in large scale slope stability. A graphical presentation of the suggested slope failure categories demonstrated their interrelationship to varied slope/discontinuity parameters. Although large scale slope analyses will always involve data-limited systems, this investigation shows that comprehensive, conceptual modelling of slope failure mechanisms can deliver a significantly improved insight into slope behaviour, so that associated slope failure risks can be judged with more confidence. The consideration of combined slope failure mechanisms in the analysis of large scale open pit slopes is essential if slope behaviour is to be realistically modelled.

A discrete element model (DEM) capable of reproducing the mechanistic behavior of a triaxial compressive test performed on a Vosges sandstone specimen is presented considering similar experimental testing conditions and densely packed spherical elements with low lock-in stress. The main aim of this paper is to illustrate the calibration process of the model‟s micro-parameters when obtained from the experimental meso-parameters measured in the lab. For this purpose, a probabilistic inverse method is introduced to fully define the micro-parameters of the particle models through a joint probability density function, which is conditioned on the experimental observations obtained during a series of tests performed at the L3S-R France. The DEM captures successfully some of the rock mechanical behavior features, including the global stress-strain and failure mechanisms. Results include a detailed parametric analysis consisting of varying each DEM parameter at the time and measuring the model response on the strain-stress domain. First order statistics on probabilistic results show the adequacy of the model to capture the experimental data, including a measure of the DEM performance for different parameter combinations. Also, joint probability density functions and cross-correlations among the micro-parameters are presented.