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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
1

The Study of Alignment Shift in Flip-Chip Bonding for VCSEL Array

Chen, Cong-Ching 25 June 2001 (has links)
The study of alignment shift in flip chip bonding for VCSEL array was studied experimentally. We calculated the relation between the restoring force and the solder volume by the simulation software PadCAD. The metal pad size were 10£gm, 20£gm, 30£gm in diameter shape and 40£gm in square shape. The solder bump was electroplat by bidirection pulse in the silicon bench which was evaporated by Au/Pt/Ti. The oxidization in the surface of the solder was removed by using flux. The VCSEL array and the Si-bench in flip chip bonding was operated at the temperature 210¢J and 5 seconds. After the flip chip bonding, the minimum alignment shift in X direction was measured to be 2.2£gm. Base on the alignment shift measured result, the maximum coupling efficiency was calculated to be 48% for VCSEL array module.
2

POLYMER FLIP-CHIP BONDING OF PRESSURE SENSORS ON FLEXIBLE KAPATON FILM FOR NEONATAL CATHETERS

LI, CHUNYAN 06 October 2004 (has links)
No description available.

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