IC test socket and socket pogo pin are the major cost of consumption parts in IC testing house. Test yield is the key point to determine the profit for IC testing house. When the processing speed of CPU (Central Processing Unit) and GPU (Graphic Processing Unit) are boosting, heat generation and power dissipation became a serious problem for IC testing house. Most package type of CPU and GPU are packed by Flip-Chip BGA type. High temperature will melt the solder ball and cause test socket pogo pin to damage. The excellent cooling capability of impinging jet had been proofed by many literatures in past. In this article, impinging jet applied to IC test handler contact chuck is investigated. The contact chuck had been redesigned with thermal solution and uses a rectangle hot plate to simulate the thermal status of IC testing. A circular air jet impinged on the rectangle hot plate from the topside of contact chuck. Out flow open area, open area on the wall location and the distance between jet nozzle and hot plate are major parameters of this heat transfer problem. Parameter ¡§Z¡¨ is the distance between jet nozzle and hot plate; ¡§D¡¨ is the diameter of circular air jet. As shown in the result, ratio of Z/D and the location of out flow open area on the wall is obvious on heat transfer capability for redesigned contact chuck. Taguchi method and analysis of variance (ANOVA) method help to clarify the weighting of influence. The optimum Z/D is 0.5 and the optimum location of out flow open area is at dual side corner. Heat transfer capability can be improved approach to 70% after optimization. Width and height of out flow open area only made about 5% impact on heat transfer capability.