Weathering releases lithogenic elements to soil and stream waters that support life in catchment ecosystems. Seasonal and inter-annual variations in hydrologic conditions change subsurface flowpaths, modifying the influence of weathering on stream waters. This study, over two climatically variable years, determined seasonal and inter-annual changes in solute sources to streams using a multi-tracer approach including major cations, strontium isotopes, germanium (Ge)/silica ratios, carbon species, and trace metals. Stream water cations display constant concentrations although discharge response was highly variable, suggesting that there is a consistent subsurface water supply. However, Sr isotope ratios, and concentrations of Ge, Fe, Al, and dissolved organic carbon, which originate from shallow soil waters, increase with the hydrograph during a wet winter snowmelt. This indicates that during a year with a thick snowpack, stream waters contain components of both shallow soilwater and groundwater during snowmelt, whereas during all other times groundwater contributes predominantly to the stream.

Abstract The primary objective for this study is to determine the variations of germanium (Ge) to silicon (Si) ratios in diatom shells from down core sediments off the southwestern coast of the Africa. Because Ge behaves like Si in the ocean and the major source of these two elements is rivers, Ge/Si ratios of the diatom are thus expected to record the intensity of weathering on continents. Two sediment cores (Site 1081 and 1084) were collected during the ODP Leg 175 in August, October 1997 and were analyzed for intervals between 3.1 and 1.9 Ma. Generally, the (Ge/Si)diatom ratios in this study show the similar trend with those reported from the Antarctic Ocean. The decline of Ge/Si ratios after 2.5 Ma is caused by the high opal mass accumulation rate, indicating the increasing rivers input of silica to the ocean. Relatively high Ge/Si ratios of diatom shells during warm periods shown by the depleted benthic foraminiferal £_18O values from the North and Equatorial Atlantic, suggesting a scenario of intensified chemical weathering on continent. Cold periods signified by £_18O-enriched values are associated with lower Ge/Si ratios. Very likely the reduced Ge/Si values reflect the prevailing weathering on continents was less chemical-dissolving due to the dry weather in cold stages.

Le silicium (Si) et le germanium (Ge) sont les matériaux de base utilisés dans les circuits intégrés. Cependant, à cause de leur gap indirect, ces matériaux ne sont pas adaptés à la fabrication de dispositifs d'émission de lumière, comme les lasers ou diodes électroluminescentes. Comparé au Si, le Ge pur possède des propriétés optiques uniques, à température ambiante son gap direct est de seulement 140 meV au-delà du gap indirect tandis qu'il est supérieur à 2 eV dans le cas du Si. Compte tenu du coefficient de dilatation thermique du Ge, deux fois plus grand que celui du Si, une croissance de Ge sur Si à hautes températures suivie d'un refroidissement à température ambiante permet de générer une contrainte en tension dans le Ge. Cependant, l'existence d'un désaccord de maille de 4,2% entre deux matériaux conduit à une croissance Stranski-Krastanov avec la formation des films rugueux et contenant de forte densité des dislocations. Nous avons mis en évidence l'existence d'une fenêtre de température de croissance, permettant de supprimer la croissance tridimensionnelle de Ge/Si. En combinant la croissance à haute température à des recuits thermiques par cycles, une contrainte de 0,30% a pu être obtenue. Le dopage de type n a été effectué en utilisant la décomposition de GaP, ce qui produit des molécules P2 ayant un coefficient de collage plus grand par rapport à celui des molécules P4. En particulier, en mettant en oeuvre la technique du co-dopage en utilisant le phosphore et l'antimoine, nous avons mis en évidence une augmentation de l'émission du gap direct du Ge à environ 150 fois, ce qui constitue l'un des meilleurs résultats obtenus jusqu'à présent. / Silicon (Si) and germanium (Ge) are the main materials used as active layers in microelectronic devices. However, due to their indirect band gap, they are not suitable for the fabrication of light emitting devices, such as lasers or electroluminescent diodes. Compared to Si, pure Ge displays unique optical properties, its direct bandgap is only 140 meV above the indirect one. As Ge has a thermal expansion coefficient twice larger than that of Si, tensile strain can be induced in the Ge layers when growing Ge on Si at high temperatures and subsequent cooling down to room temperature. However, due to the existence of a misfit as high as 4.2 % between two materials, the Ge growth on Si proceeds via the Stranski-Krastanov mode and the epitaxial Ge films exhibits a rough surface and a high density of dislocations. We have evidenced the existence of a narrow substrate temperature window, allowing suppressing the three-dimensional growth of Ge on Si. By combining high-temperature growth with cyclic annealing, we obtained a tensile strain up to 0.30 %. The n-doping in Ge was carried out using the decomposition of GaP to produce the P2 molecules, which have a higher sticking coefficient than the P4 molecules. In particular, by implementing a co-doping technique using phosphorus and antimony, we have evidenced an intensity enhancement of about 150 times of the Ge direct band gap emission. This result represents as one of the best results obtained up to now.

L'objectif de cette thèse consiste à développer une nouvelle approche d'élaboration des îlots quantiques de Ge sur substrat de Si(001) par épitaxie sélective et à étudier les propriétés optiques et électriques de ces îlots. Deux méthodes d'épitaxie sélective ont été utilisées. La première est la croissance d'îlots quantiques de Ge dans des ouvertures obtenues par désorption partielle d'une couche de silice native. Cette approche qui ne nécessite pas de procédé technologique préalable permet d'obtenir des ouvertures, dont la dimension latérale varie entre 100 et 300 nm. Nous obtenons un ou plusieurs îlots de Ge par ouverture en fonction de cette dimension. Le silicium épitaxié sélectivement dans ces ouvertures évolue vers une forme de pyramide tronquée. En contrôlant la hauteur de cette couche, nous pouvons obtenir au sommet de celle-ci un seul îlot de Ge, même dans une grande ouverture. La deuxième est la croissance sélective des îlots quantiques de Ge dans des fenêtres obtenues par lithographie. Le nombre d'îlots et leurs positions dépendent de la taille, de la forme des fenêtres, et de la surface de la terrasse de Si. Des couches simples et des multicouches d'îlots de Ge ont été réalisées. Les propriétés optiques des îlots sélectifs sont étudiées par spectroscopie de photoluminescence et Raman. La comparaison avec les îlots auto-assemblés révèle l'absence de signaux provenant de la couche de mouillage et un décalage vers les hautes énergies. Les propriétés électriques des îlots sélectifs sont étudiées à travers des caractéristiques courant-tension de diodes Schottky en fonction de la température et des mesures électriques via une pointe AFM à température ambiante.

This paper presents a modulator driver realized as a breakdown voltage doubler which can provide a high output swing of 7.6 Vpp,diff for load impedances as low as 30 Ω, thus overcoming the limitation imposed by the collector-emitter breakdown voltage. The open-collector design gives an important degree of freedom regarding the modulator load to be driven, while significantly reducing the circuit's power consumption. The driver is capable of running at 30 Gb/s while dissipating 1 W of DC power. Thanks to the inductorless design, the active area occupied by the circuit is only 0.28 mm × 0.23 mm. The driver was realized in a 250 nm SiGe BiCMOS technology.

In this study, flash memory cells with high-k dielectric HfO2 as tunnel oxide and group IV (Si, Ge) nanocrystals were fabricated and tested. The device structure was grown by magnetron sputtering deposition method and analyzed by various diagnostic techniques such as X-ray Photoelectron Spectroscopy (XPS) and Raman spectroscopy. The use of HfO2 tunnel oxide dielectric with high permittivity constant was one of the main purposes of this study. The ultimate aim was to investigate the use of Si and Ge nanocrystals together with HfO2 tunnel oxide in the memory elements. Interface structure of the fabricated devices was studied by XPS spectroscopy. A depth profile analysis was performed with XPS. Nanocrystal formations were verified using Raman spectroscopy technique. The final part of the study includes electrical characterization of memory devices fabricated using Si and Ge floating gate. C-V (Capacitance Voltage) and G-V (Conductance-Voltage) measurements and charge storage behaviour based on C-V measurements were performed. For comparison, structure of Si and Ge layers either in thin film or in the nanocrystal form were studied. A comparison of the C-V characteristics of these two structures revealed that the memory device with thin films do not confine charge carriers under the gate electrode as should be expected for a continuous film. On the other hand, the device with nanocrystals exhibited better memory behavior as a result of better confinement in the isolated nanocrystals. Trace amount of oxygen was found to be enough to oxidize Ge nanocrystals as confirmed by the Raman measurements. The charge storage capability is weakened in these samples as a result of Ge oxidation. In general, this work has demonstrated that high-k dielectric HfO2 and group IV nanocrystals can be used in the new generation MOS based memory elements. The operation of the memory elements are highly dependent on the material and device structures, which are determined by the process conditions.

This paper presents a brief study of the two most commonly used topologies - segmented and traveling-wave - for realizing monolithically integrated electro-optical transmitters consisting of Si-photonics Mach-Zehnder modulators and their electrical drivers. To this end, two new transmitters employing high swing breakdown voltage doubler drivers were designed in the aforementioned topologies and compared with regard to their extinction ratio and DC power consumption at the data rate of 30 Gb/s. It is shown that for the targeted data rate and extinction ratio, a considerably lower power consumption can be achieved with the traveling-wave topology than with its segmented counterpart. The transmitters were realized in a 250 nm SiGe BiCMOS electronic-photonic integrated technology.