dimensional integrated circuits (3D ICs) fabricated with through-silicon vias (TSVs) have smaller planar dimensions, shorter wire length, and better performance than 2D ICs. Heat dissipation causing temperature increase has posed new challenges for design of 3D integrated circuits (IC). In addition to the thermal problem, 3D ICs also require careful design of power grids/network because many inter-tier resistive through-silicon vias in 3D IC can cause larger voltage drop than 2D ICs. The performance optimization of a 3D stack requires validation of thermal and electrical integrity during the co-design. Many 3D stacks will combine digital and analog circuitry, requiring a strong mixed-signal design approach. This will require close collaboration between different domains of circuit fabrication which traditionally have been working separately. Hence there must be some standards to facilitate smooth and effective design of 3D ICs. In this thesis, we perform steady-state electrical and thermal simulations to analyze the properties of a 3D stack. We optimize electrical and thermal performance using genetic algorithm to achieve optimized power map profile for minimizing voltage drop and temperature, which can benefit both thermal and power integrity management. This thesis presents initial efforts in designing such standards. Steady state electrical and thermal simulations are performed to demonstrate the necessary information that needs to be exchanged between the dies to ensure adequate co-design. The main purpose of a Design Exchange Format (DEF) between dies is to permit sharing of information necessary for design by external parties without disclosing their intellectual property (IP). The requirements of the standards should be the minimum necessary to produce satisfactory answers. Producing such models is just a customer support function. The role of the standards is to facilitate the transfer of information through a compact model, not necessarily to build one.