NDLTD Global ETD Search
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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

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Thermo-mechanical Analysis of Bump Joints for Packages in Flip Chip Assemblies

Mohammadi Panah, Mahshid January 2014 (has links)
No description available.
Area array flip chip
Gold bump joint
Thermal mismatch
Thermo mechanical failure

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