This dissertation reports on the design and implementation of a high-frequency, tri-axial capacitive resonant gyroscopes integrated on a single chip. The components that construct tri-axial rotation sensing consist of a yaw, a pitch and a roll device. The yaw-rate gyroscope has a wide bandwidth and a large full-scale range, and operates at a mode-matched condition with DC polarization voltage of 10V without frequency tuning requirement. The large bandwidth of 3kHz and expected full-scale range over 30,000˚/sec make the device exhibit fast rate response for rapid motion sensing application. For the pitch-and-roll rate sensing, an in-plane drive-mode and two orthogonal out-of-plane sense-modes are employed. The rotation-rate sensing from lateral axes is performed by mode-matching the in-plane drive-mode with out-of-plane sense-modes to detect Coriolis-force induced deflection of the resonant mass. To compensate process variations and thickness deviations in the employed silicon-on-insulator (SOI) substrates, large electrostatic frequency tunings of both the drive and sense modes are realized. A revised high aspect ratio combined polysilicon and silicon (HARPSS) process is developed to resolve the Coriolis response that exists toward out-of-plane direction while drive-mode exists on in-plane, and tune individual frequencies with minimal interference to unintended modes. To conclude and overcome the performance limitation, design optimization of high-frequency tri-axial gyroscopes is suggested. Q-factor enhancement through reduction of thermoelastic damping (TED) and optimizations of physical dimensions are suggested for the yaw disk gyroscope. For the pitch-and-roll gyroscope, scaling property of physical dimension and its subsequent performance enhancement are analyzed.