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Atomic layer deposition and properties of refractory transition metal-based copper-diffusion barriers for ULSI interconnectLemonds, Andrew Michael, Ekerdt, John G., White, John M., January 2003 (has links) (PDF)
Thesis (Ph. D.)--University of Texas at Austin, 2003. / Supervisors: J. G. Ekerdt and J. M. White. Vita. Includes bibliographical references. Available also from UMI Company.
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