• Refine Query
  • Source
  • Publication year
  • to
  • Language
  • 3
  • 2
  • Tagged with
  • 5
  • 5
  • 2
  • 2
  • 1
  • 1
  • 1
  • 1
  • 1
  • 1
  • 1
  • 1
  • 1
  • 1
  • 1
  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
1

Überwachsen strukturierter Epitaxieschichten mit der Molekularstrahl-Epitaxie zur Herstellung opto-elektronischer integrierter Schaltkreise

Passenberg, Wolfgang. January 2000 (has links) (PDF)
Duisburg, Universiẗat, Diss., 2000.
2

Ultraschnelle Ladungsträgerdynamik in LTG-GaAs und ErAs:GaAs Übergittern Grundlagen und Anwendungen /

Griebel, Martin. January 2002 (has links)
Stuttgart, Univ., Diss., 2002.
3

Integrated silicon optoelectronics /

Zimmermann, Horst, January 2000 (has links)
Univ., Habil.-Schr.--Kiel, 1999. / Literaturverz. S. [297] - 323.
4

Monolithische Integration von Heterostruktur-Bipolartransistoren und Elektroabsorptionsmodulatoren auf InP

Reimann, Thorsten. Unknown Date (has links) (PDF)
Essen, Universiẗat, Diss., 2004--Duisburg.
5

Modeling and characterization of optical TSVs

Killge, Sebastian, Charania, Sujay, Neumann, Niels, Al-Husseini, Zaid, Plettemeier, Dirk, Bartha, Johann W., Henker, Ronny, Ellinger, Frank 06 September 2019 (has links)
In future, computing platforms will invoke massive parallelism by using a huge number of processing elements. These elements need broadband interconnects to communicate with each other. Following More-than-Moore concepts, soon large numbers of processors will be arranged in 3D chip-stacks. This trend to stack multiple dies produces a demand for high-speed intraconnects (within the 3D stack) which enable an efficient operation. Besides wireless electronic solutions (inductive or capacitive as well as using antennas), optical connectivity is an option for bit rates up to the Tbit/s range, too. We investigated different candidates for optical TSVs. For optical transmission via optical Through-Silicon-Vias, we were able to demonstrate negligible losses and dispersion.

Page generated in 0.0944 seconds