<p>Here presents the studies of polymerization kinetics and crosslinking efficiency of nm-resolution striped phases on surface, which depends on lengths of alkyl segments and headgroup chemistry. While fluorescence readouts offer the overall efficiencies of polymerization and crosslinking transfer, SPM measurements reveal molecular details accounting for reactivity differences. Additionally, this research also demonstrates the utilization of primary amines striped phases on soft materials, achieving post-functionalization and specific  adsorption of nanocrystals, highlighting the versatile applications of this nm-scale chemistry boundary.</p>

A reliable and robust diffusion barrier, commonly known as under bump metallisation (UBM), is indispensable in solder interconnects in order to retard the interfacial reaction rate, hence the growth of intermetallic compounds (IMCs). However, electroless Ni-P coatings are not adequate to inhibit interfacial reactions effectively since the formation of columnar structure and voids in the crystalline Ni3P layer in hybrid automotive devices (operating temperature above 300ºC) can significantly deteriorate the mechanical integrity of solder joints. In this thesis, electroless Ni-W-P coatings, as an effective UBM capable to serving under high temperature (up to 450ºC), are developed, characterised and subsequently applied onto the high temperature lead-free solder interconnects.