We have fabricated a laser array module using a passive self-aligned flip-chip bonding technique. Silicon optical bench was used as a submount with PbSn (Tm=183¢J) solder bump and V-grooves. A 4-channel laser array was flip-chip mounted with coupling efficiency of 56% to cleaved 62.5/125£gm multimode fiber ribbons. The optimum fabrication parameters were bonding time of 20 seconds and bonding load of 10g. The average misalignments were measured to be 1£gm and 5£gm for X and Y directions , respectively.