Thesis (M.Phil.)--Hong Kong University of Science and Technology, 2008. / Includes bibliographical references (leaves 92-94). Also available in electronic version.

Thesis (M. S.)--Chemistry and Biochemistry, Georgia Institute of Technology, 2010. / Committee Chair: Marder, Seth; Committee Member: Curtis, Jennifer; Committee Member: Riedo, Elisa. Part of the SMARTech Electronic Thesis and Dissertation Collection.

Thesis (M.S.)--Montana State University--Bozeman, 2005. / Typescript. Chairperson, Graduate Committee: David Dickensheets. Includes bibliographical references (leaves 65-66).

Thesis (M.S.)--Rowan University, 2005. / Typescript. Includes bibliographical references.

Thesis (Ph. D.)--University of Texas at Austin, 2007. / Vita. Includes bibliographical references.

Multiple thin films which are conducting, insulating and semiconducting are important components of integrated circuit technology. Circuits are fabricated from these layers by patterning the films to form isolated circuit elements which are themselves interconnected by patterned films (1).

No description available.

Electron beam lithography (EBL) and Nanoimprint Lithography (NIL) are the promising tools for today’s technology in terms of resolution capability, fidelity and cost of operation. Achieving highest possible resolution is a key concept for EBL where there is a huge request in applications of nanotechnology for sub-20 nm feature sizes. Defining features at these length scales is a challenge, and there is a large demand for resist that is not only capable of giving high resolution but also having low cost and ease of process. In this work I studied Polystyrene (PS) which is an alternative organic e-beam resist in terms of ease of process and resolution capability. I examined the process of electron-beam exposure and attempted to characterize the factors that affect the achieved resolution and sensitivity. Besides this work, I designed and fabricated a new type of mold for NIL since mold fabrication is a key factor for NIL technology. The resolution of NIL process depends on the mold features and polymer mold technology received great attention in terms of cost of fabrication and process, fidelity, and reliability. I used MD 700 Fluoropolymer as a new type of polymer mold which was believed to be a good candidate for the polymer mold of high throughput NIL.

A system for the patterning of amines through the thermal decomposition of a thin polymer film was proposed. The polymer was synthesized and films were produced by spin coating. The pyrolysis of both the polymer and the films was studied. The physical properties of the film, such as Tg, were controlled through crosslinking of the polymer and the crosslinking conditions were optimized. Analyses of the reactions that occur on the film as a result of thermal decomposition were studied. These studies seem to indicate that the thin film system studied is viable option toward the patterning of amines. The ability to bind material to the polymer films after deprotection was demonstrated using fluorescent protein and fluorescein isothiocyanate. Micron scale patterns of these fluorescent molecules were created and imaged, successfully demonstrating the viability of the system for patterning. Patterns of polyphenylene vinlyene were produced through the thermal decomposition of a tetrahydrothiophenium chloride salt precursor. Images of the patterns were obtained.

Electron beam lithography (EBL) and Nanoimprint Lithography (NIL) are the promising tools for today’s technology in terms of resolution capability, fidelity and cost of operation. Achieving highest possible resolution is a key concept for EBL where there is a huge request in applications of nanotechnology for sub-20 nm feature sizes. Defining features at these length scales is a challenge, and there is a large demand for resist that is not only capable of giving high resolution but also having low cost and ease of process. In this work I studied Polystyrene (PS) which is an alternative organic e-beam resist in terms of ease of process and resolution capability. I examined the process of electron-beam exposure and attempted to characterize the factors that affect the achieved resolution and sensitivity. Besides this work, I designed and fabricated a new type of mold for NIL since mold fabrication is a key factor for NIL technology. The resolution of NIL process depends on the mold features and polymer mold technology received great attention in terms of cost of fabrication and process, fidelity, and reliability. I used MD 700 Fluoropolymer as a new type of polymer mold which was believed to be a good candidate for the polymer mold of high throughput NIL.