For the application of 4G wireless communication system, this thesis aims to develop a high-quality-factor and low-power-dissipation suspending micro-inductor using electrochemical deposition and surface micromachining technologies. This research presents three technical points to improve the quality factor and reduce the power dissipation of micro inductor, including (i) to adopt a low resistivity material (copper) as the conducting layer to decrease the Eddy current due to the skin effect and reduce the total series resistance and energy loss, (ii) to utilize a suspending structure to diminish the power loss through the substrate and (iii) to replace the silicon wafer with a high resistance substrate (Corning 7740) to compress effectively the power dissipation in high frequency operation. The implemented suspending micro-inductors were characterized by a commercial network analyzer (Agilent E5071C) under 0.5~20 GHz testing frequency range. All the inductances and quality factors of the micro-inductors proposed in this thesis are extracted by the Agilent ADS software. The optimized value of the quality factor is around to 24.9 and the corresponding inductance is equal to 5.43 nH .