In modern microprocessors, thermal management has become one of the main hurdles in continued performance enhancement. Cooling schemes utilizing single phase microfluidics have been investigated extensively for enhanced heat dissipation from microprocessors. However, two-phase fluidic cooling devices are becoming a promising approach, and are less understood. This study aims to examine two-phase flow and heat transfer within a pin-fin enhanced micro-gap. The pin-fin array covered an area of 1cm x 1cm and had a pin diameter, height and pitch of 150μm, 200μm and 225μm, respectively, (aspect ratio of 1.33). This study covers both uniformly and partially heated scenarios. The working fluid used was R245fa. The average heat transfer coefficient and high speed flow visualization results indicated a rapid transition to the annular flow regime with a strong dependence on heat flux. Also, unique, conically-shaped two-phase wakes were observed, demonstrating the lateral spreading capability of the pin-fin array geometry.