The objective of the dissertation is to combine the recent Mixed-Mode reliability stress studies into a single text. The thesis starts with a review of silicon-germanium heterojunction bipolar transistor fundamentals, development trends, and the conventional reliability stress paths used in industry, after which the new stress path, Mixed-Mode stress, is introduced. Chapter 2 is devoted to an in-depth discussion of damage mechanisms that includes the impact ionization effct and the selfheating effect. Chapter 3 goes onto the impact ionization effect using two-dimensional calibrated MEDICI simulations. Chapter 4 assesses the reliability of SiGe HBTs in extreme temperature environments by way of comprehensive experiments and MEDICI simulations. A comparison of the device lifetimes for reverse-EB stress and mixed-mode stress indicates different damage mechanisms govern these phenomena. The thesis concludes with a summary of the project and suggestions for future research in chapter 5.

The main objective of this study is to evaluate mixed mode stress intensity factors for inclined embedded cracks in functionally graded materials. Fracture analysis of inclined cracks requires the calculation of both Mode I and Mode II stress intensity factors ( I K , II K ). In this study, k J -integral is used to calculate I K and II K . Equivalent domain integral approach is utilized to evaluate the k J - integral around the crack tip. The present study aims at developing a finite element model to study inclined crack problems in graded media under thermomechanical loading. A two dimensional finite element model is developed for inclined cracks located in a functionally graded medium. Structural and thermal problems are solved using two dimensional finite elements namely 8- noded triangles. Material properties are sampled directly at the integration points of the elements, as required by the numerical integral evaluation. The main results of the study are the stress intensity factors at the crack tip for functionally graded materials subjected to thermomechanical loading.

The main objective of this study is to model and analyze a three dimensional inclined semi-elliptic surface crack in a Functionally Graded Material (FGM) coating bonded to a homogeneous substrate with a bond coat. The parametric analyses on FGMs are based upon zirconia-yttria (ZrO2-8wt%-Y2O3) FGM coating bonded to a substrate made of a nickel-based superalloy. It is assumed that there is a nickel-chromium&amp / #8211 / aluminum&amp / #8211 / zirconium (NiCrAlY) bond coat between the FGM coating and substrate. Metal-rich, linear variation, ceramic-rich and homogeneous ceramic FGM coating types are considered in the analyses. The inclined semi-elliptic surface crack problem in the FGM coating-bond coat-substrate system is analyzed under transient thermal loading. This problem is modeled and analyzed by utilizing three dimensional finite elements. Strain singularity around the crack front is simulated using collapsed 20 &amp / #8211 / node quarter &amp / #8211 / point brick elements. Three &amp / #8211 / dimensional displacement correlation technique is utilized to extract the mixed mode stress intensity factors around the crack front for different inclination angles of the semi-elliptic surface crack. The energy release rates around the crack front are also calculated by using the evaluated mixed mode stress intensity factors. The results obtained in this study are the peak values of mixed mode stress intensity factors and energy release rates around the crack front for various inclination angles of the semi-elliptic surface crack embedded in the FGM coating of the composite structure subjected to transient thermal loading.

The main aim of this study is to utilize a Jk-integral based computational method in order to calculate crack tip parameters for orthotropic functionally graded materials (FGMs). The crack is subjected to mixed mode thermal loading. Mixed mode thermal fracture analysis requires the calculation of mode-I and mode-II stress intensity factors (KI ,KII ). In addition to stress intensity factors, energy release rate and T-stress are calculated by means of Jk-integral. Jk-integral is defined as a line integral over a vanishingly small curve. Since it is difficult to deal with a line integral on a vanishing curve , Jk-integral is converted to a domain independent form containing area and line integrals by the help of plane thermoelasticity constitutive relations. Steady-state temperature distribution profiles in FGMs and the components of the Jk-integral are computed by means of the finite element method. In both thermal and structural analyses, finite element models that possess graded isoparametric elements are created in the general purpose finite element analysis software ANSYS. In the formulation of Jk-integral, all required engineering material properties are assumed to possess continuous spatial variations through the functionally graded medium. The numerical results are compared to the results obtained from Displacement Correlation Technique (DCT). The domain independence of Jk-integral is also demonstrated. The results obtained in this study show the effects of crack location and material property gradation profiles on stress intensity factors, energy release rate and T-stress.