The main objective of the project was to establish a fracture-mechanics energy-based approach for the design of structural adhesive joints under cyclic loading. This required understanding how an adhesive system behaved near its fatigue threshold, and how the key factors affected this behavior in a fresh undegraded joint. The investigated factors were mode ratio (phase angle), substrate material, surface treatment and surface roughness (both affecting the bond strength), bondline thickness and load ratio. It was first required to understand how the adhesive system behaved under quasi-static loading by examining a fracture mechanics-based design approach for adhesive systems with different substrate materials and geometries. Experiments were initially performed to characterize the strength of aluminum and steel adhesive systems based on the fracture envelope, critical strain energy release rate as a function of the mode ratio. Ultimate failure loads of aluminum and steel adhesive joints, having different overlap end conditions and different geometries were then experimentally measured. These values were compared with the failure loads extracted from the fracture envelope. Considering the toughening behavior of the adhesive in the fracture mechanics analyses, a very good agreement (average of 6%) was achieved between the predictions and experiments for all types of overlap end conditions and geometries. Different fatigue threshold testing approaches, which are commonly used in the literature or suggested by the ASTM standard, were evaluated for the cracked and intact fillet joints. Based on the experimental and analytical studies, the most appropriate technique for fatigue testing and characterization of adhesive systems was suggested. Comparing the mixed-mode near-threshold behavior of different adhesive systems with the fracture behavior and fatigue mode-I and mixed-mode high crack growth rates showed the high sensitivity of the mixed-mode near-threshold fatigue to the subtle changes in the interfacial bond strength. In order to make a baseline for the design of adhesive joints under cyclic loading, similar to the previous fracture tests and following the energy-based approach, fatigue behavior was characterized as a function of the loading mode ratio for aluminum and steel adhesive joints. The effect of substrate material, surface treatment, bondline thickness, surface roughness and fatigue testing load ratio on the near-threshold fatigue behavior of adhesives joints was evaluated experimentally. The experimental observations were then explained using finite element modeling. To generalize the conclusions, the majority of experiments and studies covered a broad range of crack growth rates, as low as fatigue threshold and as high as 10-2 mm/cycle. Having understood the significant testing and design parameters, an adhesive system can be designed based on a safe cyclic load that produces an insignificant (for automotive industry) or reasonably low but known crack growth rate (for aerospace industry).

The main objective of the project was to establish a fracture-mechanics energy-based approach for the design of structural adhesive joints under cyclic loading. This required understanding how an adhesive system behaved near its fatigue threshold, and how the key factors affected this behavior in a fresh undegraded joint. The investigated factors were mode ratio (phase angle), substrate material, surface treatment and surface roughness (both affecting the bond strength), bondline thickness and load ratio. It was first required to understand how the adhesive system behaved under quasi-static loading by examining a fracture mechanics-based design approach for adhesive systems with different substrate materials and geometries. Experiments were initially performed to characterize the strength of aluminum and steel adhesive systems based on the fracture envelope, critical strain energy release rate as a function of the mode ratio. Ultimate failure loads of aluminum and steel adhesive joints, having different overlap end conditions and different geometries were then experimentally measured. These values were compared with the failure loads extracted from the fracture envelope. Considering the toughening behavior of the adhesive in the fracture mechanics analyses, a very good agreement (average of 6%) was achieved between the predictions and experiments for all types of overlap end conditions and geometries. Different fatigue threshold testing approaches, which are commonly used in the literature or suggested by the ASTM standard, were evaluated for the cracked and intact fillet joints. Based on the experimental and analytical studies, the most appropriate technique for fatigue testing and characterization of adhesive systems was suggested. Comparing the mixed-mode near-threshold behavior of different adhesive systems with the fracture behavior and fatigue mode-I and mixed-mode high crack growth rates showed the high sensitivity of the mixed-mode near-threshold fatigue to the subtle changes in the interfacial bond strength. In order to make a baseline for the design of adhesive joints under cyclic loading, similar to the previous fracture tests and following the energy-based approach, fatigue behavior was characterized as a function of the loading mode ratio for aluminum and steel adhesive joints. The effect of substrate material, surface treatment, bondline thickness, surface roughness and fatigue testing load ratio on the near-threshold fatigue behavior of adhesives joints was evaluated experimentally. The experimental observations were then explained using finite element modeling. To generalize the conclusions, the majority of experiments and studies covered a broad range of crack growth rates, as low as fatigue threshold and as high as 10-2 mm/cycle. Having understood the significant testing and design parameters, an adhesive system can be designed based on a safe cyclic load that produces an insignificant (for automotive industry) or reasonably low but known crack growth rate (for aerospace industry).

Double cantilever beam (DCB) specimens with distinct intermetallic microstructures and different geometries were fractured under different mode ratios of loading, ψ, to obtain critical strain energy release rate, Jc. The strain energy release rate at crack initiation, Jci, increased with phase angle, ψ, but remained unaffected by the joint geometry. However, the steady-state energy release rate, Jcs, increased with the solder layer thickness. Also, both the Jci and Jcs decreased with the thickness of the intermetallic compound layer. Next, mode I and mixed-mode fracture tests were performed on discrete (l=2 mm and l=5 mm) solder joints arranged in a linear array between two copper bars to evaluate the J = Jci (ψ) failure criteria using finite element analysis. Failure loads of both the discrete joints and the joints in commercial electronic assemblies were predicted reasonably well using the Jci from the continuous DCBs. In addition, the mode-I fracture of the discrete joints was simulated with a cohesive zone model which predicted reasonably well not only the fracture loads but also the overall load-displacement behavior of the specimen. Additionally, the Jci calculated from FEA were verified estimated from measured crack opening displacements in both the continuous and discrete joints. Finally, the pad-crater fracture mode of solder joints was characterized in terms of the Jci measured at various mode ratios, ψ. Specimens were prepared from lead-free chip scale package-PCB assemblies and fractured at low and high loading rates in various bending configurations to generate a range of mode ratios. The specimens tested at low loading rates all failed by pad cratering, while the ones tested at higher loading rates fractured in the brittle intermetallic layer of the solder. The Jci of pad cratering increased with the phase angle, ψ, but was independent of surface finish and reflow profile. The generality of the J =Jci(ψ) failure criterion to predict pad cratering fracture was then demonstrated by predicting the fracture loads of single lap-shear specimens made from the same assemblies.

Double cantilever beam (DCB) specimens with distinct intermetallic microstructures and different geometries were fractured under different mode ratios of loading, ψ, to obtain critical strain energy release rate, Jc. The strain energy release rate at crack initiation, Jci, increased with phase angle, ψ, but remained unaffected by the joint geometry. However, the steady-state energy release rate, Jcs, increased with the solder layer thickness. Also, both the Jci and Jcs decreased with the thickness of the intermetallic compound layer. Next, mode I and mixed-mode fracture tests were performed on discrete (l=2 mm and l=5 mm) solder joints arranged in a linear array between two copper bars to evaluate the J = Jci (ψ) failure criteria using finite element analysis. Failure loads of both the discrete joints and the joints in commercial electronic assemblies were predicted reasonably well using the Jci from the continuous DCBs. In addition, the mode-I fracture of the discrete joints was simulated with a cohesive zone model which predicted reasonably well not only the fracture loads but also the overall load-displacement behavior of the specimen. Additionally, the Jci calculated from FEA were verified estimated from measured crack opening displacements in both the continuous and discrete joints. Finally, the pad-crater fracture mode of solder joints was characterized in terms of the Jci measured at various mode ratios, ψ. Specimens were prepared from lead-free chip scale package-PCB assemblies and fractured at low and high loading rates in various bending configurations to generate a range of mode ratios. The specimens tested at low loading rates all failed by pad cratering, while the ones tested at higher loading rates fractured in the brittle intermetallic layer of the solder. The Jci of pad cratering increased with the phase angle, ψ, but was independent of surface finish and reflow profile. The generality of the J =Jci(ψ) failure criterion to predict pad cratering fracture was then demonstrated by predicting the fracture loads of single lap-shear specimens made from the same assemblies.