Electrically conductive adhesives (ECA) are discussed and studied with everincreasing interest as an environmentally friendly alternative to solder interconnection in microelectronics circuit packaging. They are used to attach surface mount devices (SMD), Integrated Circuits (IC) and Flip chips in electronic assembly. The use of ECAs brings some benefits like flexibility, mild processing conditions and process simplicity. Multi walled carbon nanotubes (MWCNT) are used instead of metal fillers because of their novel properties such as light weight, high aspect ratio, corrosion resistant, reduced processing temperature, lead free, good electrical conduction and mechanical strength. The purpose of the present work is to investigate the aging behavior of MWCNT filled adhesives based on anhydride cured epoxy systems and their dependence on loading. Composites with different loadings of MWNT in epoxy and epoxy: heloxy are prepared and then stencil printed onto different surface finished boards like gold, silver and tin to prepare contact resistance samples and onto aluminum oxide boards to prepare volume resistivity samples. These samples are kept at room temperature for about 90 days and then placed in a temperature chamber to observe the behavior of these samples after accelerated aging. The readings are taken for as prepared samples, after 45 days, after 90 days and after accelerated aging. The results are summarized and different trends are observed for different loadings of MWNT, different combinations of epoxy: heloxy and for different surface finished boards.

Conducting vertical nanopillar arrays can serve as three-dimensional nanostructured electrodes with improved performance for electrical recording and electrochemical sensing in bio-electronics applications. However, vertical nanopillar-array electrodes made of inorganic conducting materials by conventional nanofabrication approach still faces challenges in high manufacturing costs, poor scalability, and limited choice of carrier substrates. Here, we report a new type of conducting nanopillar arrays composed of multi-walled carbon nanotubes (MWCNTs) doped polymeric nanocomposites, which are manufactured over the wafer-scale on both rigid and flexible substrates by direct nanoimprinting of perfluoropolyether nanowell-array templates into uncured MWCNT/polymer mixtures. By controlling the MWCNT ratios and the annealing temperatures during the fabrication process, MWCNT/polymer nanopillar arrays can possess outstanding electrical properties with high DC conductivity (~4 S/m) and low AC electrochemical impedance (~104 Ω at 1000 Hz). Moreover, by electrochemical impedance spectroscopy (EIS) measurements and equivalent circuit modeling-analysis, we can decompose the overall impedance of MWCNT/polymer nanopillar arrays in the electrolyte into multiple bulk and interfacial circuit components, and thus can illustrate their different dependence on the MWCNT ratios and the annealing temperatures. In particular, we find that a proper annealing process can significantly reduce the anomalous ion diffusion impedance and improve the impedance properties of MWCNT/polymer nanopillars in the electrolyte. / Master of Science / Conducting vertical nanopillar arrays can serve as three-dimensional nanostructured electrodes with improved performance for electrical recording and electrochemical sensing in nano-bioelectronics applications. However, vertical nanopillar-array electrodes made of inorganic conducting materials by conventional nanofabrication approach still faces challenges in high manufacturing costs, poor scalability, and limited choice of carrier substrates. Compared to conventional nanofabrication approaches, nanoimprint lithography exhibits unique advantages for low-cost scalable manufacturing of nanostructures on both rigid and flexible substrates. Very few studies, however, have been conducted to achieve the scalable nanoimprinting fabrication of conducting nanopillar arrays made of MWCNT/polymer nanocomposites. Here, I'm reporting a new type of conducting nanopillar arrays composed of multi-walled carbon nanotubes (MWCNTs) doped polymeric nanocomposites, which can be manufactured over the wafer-scale on both rigid and flexible substrates by direct nanoimprinting of the perfluoropolyether nanowell-array template into uncured MWCNT/polymer mixtures. We find that the nanoimprinted conducting nanopillar arrays can possess appealing electrical properties with a high DC conductivity (~4 S/m) and a low AC electrochemical impedance (~104 Ω at 1000 Hz) in the physiologically relevant electrolyte solutions (1X PBS). Furthermore, I've conducted a systematic equivalent circuit modeling analysis of measured EIS results to understand the effects of the MWCNT ratios and the annealing temperatures on the impedance of different bulk and interfacial circuit components for MWCNT/polymer nanopillar arrays in the electrolyte.

Electrically conductive adhesives (ECA) are an alternative to tin/lead solders for attaching Surface Mount Devices (SMD) in electronic assemblies. ECAs are mixtures of a polymer binder (for adhesion) and conductive filler (for electrical conductivity). They bring more conductivity, higher strength, less weight and longer durability than metal alloys. ECAs can offer numerous advantages such as fewer processing steps, lower processing temperature and fine pitch capability. Multi walled carbon nanotubes (MWCNT) were used as conductive fillers in this research because of their novel electronic and mechanical properties. The high aspect ratio of the nanotubes makes it possible to percolate at low loadings to obtain good electrical and mechanical properties. Replacing the metal filler with CNTs in the adhesive made the ECA light weight, corrosion resistant, reduced processing temperature, lead free, electrically conductive and high mechanical strength. The MWCNTs at different loadings were mixed with epoxy and epoxy: heloxy to form a composite mixture. Different loadings, additives and mixing methods were used to obtain good electrical and mechanical properties and pot life. Pressure dispensing, screen and stencil printing were the processing techniques used for making the samples. The volume resistivity, contact resistance, die shear and lap shear tests were conducted on different surface finished Printed Circuit Boards (PCB) like silver, tin and Electro less Nickel Immersion Gold (ENIG). The results are summarized and compared with traditional methods.