O presente trabalho está relacionado a estudos de superligas à base de Ni, cujas microestruturas multifásicas apresentam propriedades satisfatórias para aplicações em altas temperaturas. O Nb e o Ta são componentes importantes nesta classe de materiais, estando normalmente associados às fases endurecedoras ?\' e \'\'. Desta forma, a determinação das relações de fases no sistema Ni-Nb-Ta na região rica em Ni corresponde a uma importante contribuição para a literatura referente, especialmente para os trabalhos ligados à construção de base de dados termodinâmicos. Assim, foi definido como objetivo principal a proposição das relações de fases na região rica em Ni do sistema Ni-Nb-Ta para a temperatura de 1050oC. As ligas foram obtidas por fusão a arco e tradas termicamente a 1050ºC por no mínimo 120 h. Amostras no estado bruto de fusão e tratadas termicamente foram caracterizadas microestruturalmente (MEV e DRX) e por microanálise química (EDS). Na região de estudo, observou-se as fases Niss, Ni8Ta, Ni3(Nb,Ta), Ni2(Nb,Ta), e ? (NiTa; Ni6Nb7), sem a presença de qualquer fase ternária. Observou-se uma solubilidade completa de Nb e Ta nas fases Ni3(Nb,Ta) e ?. A fase Ni2Ta apresentou uma solubilidade de Nb próxima de 13% at. Não foi possível determinar a região de solubilidade de Nb na fase Ni8Ta. / This work is related to studies of Ni-based superalloys, which multiphase microstructures have satisfactory properties for high temperature applications. The Nb and Ta are important components in this class of materials and is typically associated with the hardening phases ? \' and .\'\' Thus, the determination of phase relationships in the system Ni-Nb-Ta in the Ni-rich region represents an important contribution to the literature, especially for determination of related thermodynamic data. Thus, the main objective of this work was to propose the phase relationships in the Ni-rich region of the system Ni-Nb-Ta at 1050oC. The alloys were obtained by arc melting and heat-treated at 1050 º C for at least 120 h. Samples in the a-scast and heat treated states were characterized via (SEM and XRD) and chemical microanalysis (EDS). In the region of study, the observed phases were Niss, Ni8Ta, Ni3(Nb, Ta), Ni2(Nb,Ta), and ? (NiTa; Ni6Nb7) without the presence of any ternary phase. There was a complete solubility of Nb and Ta in the Ni3(Nb,Ta) and ? phases. The Ni2Ta showed a solubility of Nb close to 13% at. It was not possible to determine the region of solubility of Nb in the Ni8Ta phase.

O presente trabalho está relacionado a estudos de superligas à base de Ni, cujas microestruturas multifásicas apresentam propriedades satisfatórias para aplicações em altas temperaturas. O Nb e o Ta são componentes importantes nesta classe de materiais, estando normalmente associados às fases endurecedoras ?\' e \'\'. Desta forma, a determinação das relações de fases no sistema Ni-Nb-Ta na região rica em Ni corresponde a uma importante contribuição para a literatura referente, especialmente para os trabalhos ligados à construção de base de dados termodinâmicos. Assim, foi definido como objetivo principal a proposição das relações de fases na região rica em Ni do sistema Ni-Nb-Ta para a temperatura de 1050oC. As ligas foram obtidas por fusão a arco e tradas termicamente a 1050ºC por no mínimo 120 h. Amostras no estado bruto de fusão e tratadas termicamente foram caracterizadas microestruturalmente (MEV e DRX) e por microanálise química (EDS). Na região de estudo, observou-se as fases Niss, Ni8Ta, Ni3(Nb,Ta), Ni2(Nb,Ta), e ? (NiTa; Ni6Nb7), sem a presença de qualquer fase ternária. Observou-se uma solubilidade completa de Nb e Ta nas fases Ni3(Nb,Ta) e ?. A fase Ni2Ta apresentou uma solubilidade de Nb próxima de 13% at. Não foi possível determinar a região de solubilidade de Nb na fase Ni8Ta. / This work is related to studies of Ni-based superalloys, which multiphase microstructures have satisfactory properties for high temperature applications. The Nb and Ta are important components in this class of materials and is typically associated with the hardening phases ? \' and .\'\' Thus, the determination of phase relationships in the system Ni-Nb-Ta in the Ni-rich region represents an important contribution to the literature, especially for determination of related thermodynamic data. Thus, the main objective of this work was to propose the phase relationships in the Ni-rich region of the system Ni-Nb-Ta at 1050oC. The alloys were obtained by arc melting and heat-treated at 1050 º C for at least 120 h. Samples in the a-scast and heat treated states were characterized via (SEM and XRD) and chemical microanalysis (EDS). In the region of study, the observed phases were Niss, Ni8Ta, Ni3(Nb, Ta), Ni2(Nb,Ta), and ? (NiTa; Ni6Nb7) without the presence of any ternary phase. There was a complete solubility of Nb and Ta in the Ni3(Nb,Ta) and ? phases. The Ni2Ta showed a solubility of Nb close to 13% at. It was not possible to determine the region of solubility of Nb in the Ni8Ta phase.

The electro–mechanical connection between under bump metallization (UBM) and solder in flip–chip bonding is achieved by the formation of brittle intermetallic compounds (IMCs) during the soldering process. These IMCs continue to grow in the solid–state during storage at room temperature and service at an elevated temperature leading to degradation of the contacts. In this thesis, the diffusion–controlled growth mechanism of the phases and the formation of the Kirkendall voids at the interface of UBM (Cu, Ni, Au, Pd, Pt) and Sn (bulk/electroplated) are studied extensively. Based on the microstructural analysis in SEM and TEM, the presence of bifurcation of the Kirkendall marker plane, a very special phenomenon discovered recently, is found in the Cu–Sn system. The estimated diffusion coefficients at these marker planes indicate one of the reasons for the growth of the Kirkendall voids, which is one of the major reliability concerns in a microelectronic component. Systematic experiments using different purity of Cu are conducted to understand the effect of impurities on the growth of the Kirkendall voids. It is conclusively shown that increase in impurity enhances the growth of voids. The growth rates of the interdiffusion zone are found to be comparable in the Cu–Sn and the Ni–Sn systems. EPMA and TEM analyses indicate the growth of a metastable phase in the Ni–Sn system in the low temperature range. Following, the role of Ni addition in Cu on the growth of IMCs in the Cu–Sn system is studied based on the quantitative diffusion analysis. The analysis of thermodynamic driving forces, microstructure and crystal structure of Cu6Sn5 shed light on the atomic mechanism of diffusion. It does not change the crystal structure of phases; however, the microstructural evolution, the diffusion rates of components and the growth of the Kirkendall voids are strongly influenced in the presence of Ni. Considering microstructure of the product phases in various Cu/Sn and Cu(Ni)/Sn diffusion couples, it has been observed that (i) phases have smaller grains and nucleate repeatedly, when they grow from Cu or Cu(Ni) alloy, and (ii) the same phases have elongated grains, when they grow from another phase. A difference in growth rate of the phases is found in bulk and electroplated diffusion couples in the Au–Sn system. The is explained in AuSn4 based on the estimated tracer diffusion coefficients, homologous temperature of the experiments, grain size distribution and crystal structure of the phase. The growth rates of the phases in the Au–Sn system are compared with the Pd–Sn and the Pt–Sn systems. Similar to the Au–Sn system, the growth rate of the interdiffusion zone is found to be parabolic in the Pd–Sn system; however, it is linear in the Pt–Sn system. Following, the effect of addition of Au, Pd and Pt in Cu is studied on growth rate of the phases. An analysis on the formation of the Kirkendall voids indicates that the addition of Pd or Pt is deleterious to the structure compared to the addition of Au. This study indicates that formation of voids is equally influenced by the presence of inorganic as well as organic impurities.