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1	Lamellar spiralling in directionally frozen eutectics Attallah, Teresa S. January 1975 (has links) No description available. Engineering, General. Eutectic alloys.
2	Eutectic solidification in hypoeutectic mg-al alloys / Nave, Mark D. January 2001 (has links) (PDF) Thesis (Ph. D.)--University of Queensland, 2001. / Includes bibliographical references.
3	Chemical etching and ion milling of uranium dioxide-tungsten unidirectional composites Prosser, Sherman Lee January 1978 (has links) No description available. Ceramic metals Uranium dioxide Eutectic alloys
4	Selective chemical etching of unidirectional zirconia-tungsten eutectic composites Moh, Kyung Hwa 08 1900 (has links) No description available. Etching reagents Metals Etching Eutectic alloys
5	Some aspects of the nature of eutectics Hogan, Leonard McNamara. Unknown Date (has links) No description available. Eutectic alloys.
6	Investigation and analysis on the solder ball shear strength of plastic ball grid array, chip scale, and flip chip packages with eutectic Pb-Sn and Pb-free solders / Huang, Xingjia. January 2003 (has links) Thesis (Ph. D.)--Hong Kong University of Science and Technology, 2003. / Includes bibliographical references. Also available in electronic version. Access restricted to campus users.
7	Wear and microstructure of eutectoid steels / Danks, Daniel, January 1989 (has links) Thesis (Ph. D.)--Oregon Graduate Center, 1989.
8	Casting and analysis of squeeze cast aluminium silicon eutectic alloy : a thesis presented in partial fulfilment of the requirements for the degree of Doctor of Philosophy in Mechanical Engineering at the University of Canterbury, Christchurch, New Zealand / Smillie, Matthew. January 2006 (has links) Thesis (Ph. D.)--University of Canterbury, 2006. / Typescript (photocopy). Includes bibliographical references (p. [161]-166). Also available via the World Wide Web.
9	Diffusion Kinetics and Microstructure of Eutectic and Composite Solder/Copper Joints Wu, Yujing 05 1900 (has links) Sn/Pb solders are widely used by the electronics industry to provide both mechanical and electrical interconnections between electronic components and printed circuit boards. Solders with enhanced mechanical properties are required for high reliability for Surface Mount Technology (SMT) applications. One approach to improve the mechanical properties of solder is to add metallic or intermetallic particles to eutectic 63Sn/37Pb solder to form composite solders. Cu6Sn5 and Cu3Sn form and grow at the solder/copper substrate interface. The formation and growth of these intermetallics have been proposed as controlling mechanisms for solderability and reliability of solder/copper joints. The goal of this study was to investigate the diffusion kinetics and microstructures of six types of composite solder/copper joints. solder physics composites Solder and soldering. Eutectic alloys. Surface mount technology.
10	Solid State Diffusion Kinetics of Intermetallic Compound Formation in Composite Solder Sees, Jennifer A. (Jennifer Anne) 05 1900 (has links) The Sn/Pb eutectic alloy system is the most widely used joining material in the electronics industry. In this application, the solder acts as both an electrical and mechanical connection within and among the different packaging levels in an electronic device. Recent advances in packaging technologies, however, driven by the desire for miniaturization and increased circuit speed, result in severe operating conditions for the solder connection. In an effort to improve its mechanical integrity, metallic or intermetallic particles have been added to eutectic Sn/Pb solder, and termed composite solders. It was the goal of this study to investigate the growth and morphology of the two intermetallic phases (Cu6Sn5 and Cu3Sn) that form between a Cu substrate and Sn/Pb solder under different aging and annealing conditions. Solid state electronics. Solder and soldering. Eutectic alloys. composite solder Sn/Pb eutectic alloy system

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