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In-process stress analysis of flip chip assembly and reliability assessment during environmental and power cycling testsZhang, Jian 01 December 2003 (has links)
No description available.
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A study of knowledge management applications in semiconductor packaging and testing industry -case of Chipbond TechnologyChiu, Min-Ying 30 August 2011 (has links)
Abstract
The 21st century is knowledge-economy era. In the era of knowledge economy, those who dominate the knowledge and the technology are able to meet the challenges in the future. Because of the competition in knowledge and technology, couple with the rise of information and internet technology, innovation strategy has also taken into the new century. In order to improve organizational performance, management and sharing of corporate knowledge as well as innovation strategies are getting more important, therefore, effective knowledge management and innovation strategy will be one of the key factors of corporate success. Knowledge is the core competitive advantage the most important and the most difficult to imitate. Only through constantly improving, attracting, creating and utilizing abundant knowledge, and integrating in its core competence can it superior to competitors.
This thesis adopts case study on one leading domestic company in semiconductor packaging and testing industry. Conduct questionnaire methodology at managers and engineers, and survey five dimensions on knowledge management processes, leadership, corporate culture, information technology and performance evaluation. The main purpose is to realize current implementation of corporate knowledge management, activities and performance, and to conclude the development of knowledge management in the company. Specifically, the purposes of this study are as follows:
First, summarize existing literature to understand the effective implementation method for knowledge management.
Second, realize corporate current status of knowledge management activities.
Third, research on how the company strengthens existing knowledge management practices to retain the core knowledge, enhance manpower quality, and create added value after merging into a fast-growing organization.
Finally, the suggestion on KM implementation is proposed for reference.
By way of questionnaire survey and in-depth interviews to understand current application and direction of knowledge management, and to conclude specific suggestions for improvement reference, hopefully this thesis benefits the company to enhance corporate competitiveness.
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An Simulative Study of Exchange Ratio Determination Model For the M&A in IC Packaging and Testing IndustryLI, Chang-chin 29 May 2006 (has links)
Abstract
After many years¡¦ M&A, the IC Packaging and Testing Industry show the trend of ¡§The big ones get bigger¡¨. The mainstream management styles of Packaging and Testing industries that run apparently into high capital intensity are the conglomerate by subsidiaries, or virtual group through M&A or equity investment. Under the inferiority of limited resources and cost competence, the small medium size of Packaging and Testing factory face the merged future. Therefore, it should find some adequate survival strategy.
Under current circumstance, the fastest method for facing the powerful competitive pressure is M&A. Due to the fact the capital of IC Packaging and Testing are huge, and most stocks have been went public, the most available method of M&A is the share-for-share Exchange or mixed payment by cash or common stock. If it involves the common stock exchange, the study for exchange rate will become very important.
This study is aimed at the related problem of share for share exchange. We use the Share-for-share Exchange model developed by Larson and Gonedes in 1969 as the basis and do some extension. We also use the dividend behavior decrease model developed by Marsh and Merton in 1987 to resolve the P/E ratio estimation problem simultaneously. The researched objects are Siliconware Precision Industries Co., Ltd ¡BGREATEK electronic¡B and IST International Semiconductor Technology Ltd. Besides, this study will also do small change in L-G model to suit the merger problem of the three IC Packaging and Testing companies.
The result shows that the reasonable negotiation of share-for-share exchange by L-G model can provide both sides a negotiated or mediated bottom line and also imply that this message will provide substantial assistance for both sides.
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