La technologie MID (Molded Interconnect Device), fait de leur performance électrique, la flexibilitédans les circuits RF, le potentiel de réduire le nombre de composants, les étapes du processus et laminiaturisation du produit final, a conduit à de nouvelles contraintes à la RF (Radio Frequency) et ledomaine des micro-ondes. Composants moulés sont interconnectées avec des substratsthermoplastiques et les pistes conductrices sont injectés sur la surface. L'objectif de cette thèse estd'étudier la compatibilité de MID pour les applications RF. Les avantages de la technologie MID dansle domaine RF est exploitée pour les lignes de transmission, filtres passifs, coupleurs directionnels etantennes réalisation. La caractérisation RF de différents matériaux de substrat MID et l'étude de laperformance des composants RF ci-dessus sur la base de différentes technologies de fabrication MIDsont inclus dans la thèse. Enfin, le concept d'une étude d'amélioration de la permittivité de certainsthermoplastiques sont également étudiés. / MID (Molded Interconnect Devices) technology, owing to their electrical performance,flexibility in RF circuits, its potential to reduce the number of components, process steps andminiaturization of the final product, has led to some new constraints to the RF (RadioFrequency) and microwave domain. Molded components are interconnected withthermoplastic substrates and conductive traces are injected on the surface. The objective ofthis thesis is to study the compatibility of MIDs for RF applications. The advantages of MIDtechnology in the RF domain is exploited for transmission lines, passive filters, directionalcouplers and planar and 3D antennas realization. The RF characterization of various MIDsubstrate materials and the study of the performance of the above RF components based onvarious MID fabrication technologies are included in the thesis. Finally, an permittivityimprovement study of some thermoplastics are also studied.

La technologie MID (Molded Interconnect Device), fait de leur performance électrique, la flexibilitédans les circuits RF, le potentiel de réduire le nombre de composants, les étapes du processus et laminiaturisation du produit final, a conduit à de nouvelles contraintes à la RF (Radio Frequency) et ledomaine des micro-ondes. Composants moulés sont interconnectées avec des substratsthermoplastiques et les pistes conductrices sont injectés sur la surface. L'objectif de cette thèse estd'étudier la compatibilité de MID pour les applications RF. Les avantages de la technologie MID dansle domaine RF est exploitée pour les lignes de transmission, filtres passifs, coupleurs directionnels etantennes réalisation. La caractérisation RF de différents matériaux de substrat MID et l'étude de laperformance des composants RF ci-dessus sur la base de différentes technologies de fabrication MIDsont inclus dans la thèse. Enfin, le concept d'une étude d'amélioration de la permittivité de certainsthermoplastiques sont également étudiés. / MID (Molded Interconnect Devices) technology, owing to their electrical performance,flexibility in RF circuits, its potential to reduce the number of components, process steps andminiaturization of the final product, has led to some new constraints to the RF (RadioFrequency) and microwave domain. Molded components are interconnected withthermoplastic substrates and conductive traces are injected on the surface. The objective ofthis thesis is to study the compatibility of MIDs for RF applications. The advantages of MIDtechnology in the RF domain is exploited for transmission lines, passive filters, directionalcouplers and planar and 3D antennas realization. The RF characterization of various MIDsubstrate materials and the study of the performance of the above RF components based onvarious MID fabrication technologies are included in the thesis. Finally, an permittivityimprovement study of some thermoplastics are also studied.

IGBT based power converters acts as front end in the present day Adjustable Speed Drive (ASD). This offers many advantages and makes regenerative action possible. PWM rectifier operation produces electrically noisy DC bus on common mode basis. This results in higher ground current as compared to three phase diode bridge rectifier. Due to fast turn-ON and turn-OFF time of IGBT, the inverter output voltage dv/dt is high during switching transients and voltage waveform is rich in harmonics. As a result, in applications involving long cable the motor terminal voltage during the switching transient is as high as twice the applied voltage. This voltage stress reduces the life of insulation in motors. The high dv/dt output voltage applied at the motor terminal excites the parasitic capacitive coupling resulting in increased ground currents and causes Electric Discharge Machining (EDM) which reduces the life of motor bearings. The common mode voltage due to PWM rectifier and the inverter appear at the motor terminals exacerbating these problems. The common mode voltage due to PWM inverter with PWM rectifier is analyzed. An integrated approach for filter design is proposed wherein the adverse effects due to common mode voltage of both AFE converter and the inverter is addressed. The proposed topology addresses the problems of common mode voltage, common mode current and voltage doubling due to ASD. The design procedure for proposed filter topology is discussed with experimental results that validate the effectiveness of the filter. Inclusion of such higher order filter in the converter topology leads to problems such as resonance. Passive methods are investigated for damping the line resonance due to LCL filter and common mode resonance due to common mode filter. The need for active damping technique for resonance due to common mode filter is presented. State space based damping technique is proposed to effectively damp the resonance due to line filter and the common mode filter. Experimental results are presented that validate the effectiveness of active damping both on the line basis (differential mode) and line to ground basis (common mode) of the filter.