The target of this work is to optically interconnect a semiconductor laser and a single mode fiber (SMF) through a simple Si bench technology using buried waveguide devices. This technology is suitable for applications such as optical transceivers and add-and-drop multiplexers. Three major components, namely, planarized laser diode, buried waveguide, and SMF are hybrid integrated on the Si bench. The ridge-type laser was planarized by BCB etch-back process, and was flip-chip mounted on the Si bench. On the other hand, the sol-gel buried waveguide was passively aligned to SMF using V-groove and U-groove techniques. Miss-alignment loss as low as 1 dB can be obtained.

The objective of this thesis is to integrate the optical waveguide and single mode fiber in a passive alignment way on a silicon bench. This technique can reduce the complexity of packaging the individual components and increase yield of the module in order to achieve the goal of the mass production. In this module, buried waveguide structure was used for light guidance. A 1.31µm semiconductor laser was used as the input light source. Light signal launched by semiconductor laser is transferred through the buried waveguide into the single mode fiber. This module structure is consisted of two major parts, namely, the buried waveguide and the silicon bench. Buried optical Waveguide uses SO2 as the bottom cladding. Conventional photolithography procedures and etching technique were used to form a trench on the SiO2 cladding. The waveguide core was fabricated by coating the organic-inorganic hybrid materials into the trench. Finally, an organic-inorganic hybrid materials with a refractive index smaller than that of the core is used as the top cladding. The silicon benches were obtained by etching V-groove and saw-cutting U-groove on the silicon substrates for fixing the fiber. The patterning of buried waveguide and silicon V-groove were fabricated by a single optical mask procedure. Therefore accurate alignment between the waveguide and the single mode fiber can be obtained.

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This paper demonstrates an approach for passive alignment and assembly of link components for board-level very-short range optical interconnects. This interchip optical link is based on planar polymeric multimode waveguides and glassbased electro-optical transceivers. The main aim of the work is the investigation of assembly processes of link components in order to fulfill the tolerance requirements using passive alignment. The optical characterization in regard to the optical coupling between link components will define the tolerances for the alignment process. This optical analysis is based on measurements of spatial coupling characteristics. The influence of assembly tolerances on the coupling efficiency is investigated. Flip-chip assembly of electro-optical devices on the glass interposer and of the glass interposer on optical overlay is presented to prove the implementation of the concept.

This paper discusses the technology development for integration of parallel optical interconnects on board-level, including the active and passive optical components as well as the electrical integrated circuitry. The inter-chip link is based on planar polymeric optical multimode waveguides with integrated out-of-plane coupling optics and optical transceiver subassemblies based on glass interposer. Integration of polymeric waveguides on flexible substrates will be shown since the realization of an overlay optical substrate enhances the yield and testability of the final hybrid electrooptical printed circuit board (EOPCB). Realized on-board waveguides feature low insertion loss (minimum attenuation coefficient of below 0.1 dB/cm). For short planar waveguides (Lwaveguide = 9 cm) error free transmission (BER < 10-12) up to 30 Gbit/s was achieved. The development of glass interposer passive optical coupling structures for VCSEL-based short-distance links will be described.