abstract: Infant mortality rate of field deployed photovoltaic (PV) modules may be expected to be higher than that estimated by standard qualification tests. The reason for increased failure rates may be attributed to the high system voltages. High voltages (HV) in grid connected modules induce additional stress factors that cause new degradation mechanisms. These new degradation mechanisms are not recognized by qualification stress tests. To study and model the effect of high system voltages, recently, potential induced degradation (PID) test method has been introduced. Using PID studies, it has been reported that high voltage failure rates are essentially due to increased leakage currents from active semiconducting layer to the grounded module frame, through encapsulant and/or glass. This project involved designing and commissioning of a new PID test bed at Photovoltaic Reliability Laboratory (PRL) of Arizona State University (ASU) to study the mechanisms of HV induced degradation. In this study, PID stress tests have been performed on accelerated stress modules, in addition to fresh modules of crystalline silicon technology. Accelerated stressing includes thermal cycling (TC200 cycles) and damp heat (1000 hours) tests as per IEC 61215. Failure rates in field deployed modules that are exposed to long term weather conditions are better simulated by conducting HV tests on prior accelerated stress tested modules. The PID testing was performed in 3 phases on a set of 5 mono crystalline silicon modules. In Phase-I of PID test, a positive bias of +600 V was applied, between shorted leads and frame of each module, on 3 modules with conducting carbon coating on glass superstrate. The 3 module set was comprised of: 1 fresh control, TC200 and DH1000. The PID test was conducted in an environmental chamber by stressing the modules at 85°C, for 35 hours with an intermittent evaluation for Arrhenius effects. In the Phase-II, a negative bias of -600 V was applied on a set of 3 modules in the chamber as defined above. The 3 module set in phase-II was comprised of: control module from phase-I, TC200 and DH1000. In the Phase-III, the same set of 3 modules which were used in the phase-II again subjected to +600 V bias to observe the recovery of lost power during the Phase-II. Electrical performance, infrared (IR) and electroluminescence (EL) were done prior and post PID testing. It was observed that high voltage positive bias in the first phase resulted in little/no power loss, high voltage negative bias in the second phase caused significant power loss and the high voltage positive bias in the third phase resulted in major recovery of lost power. / Dissertation/Thesis / M.S. Engineering 2011

abstract: The primary goal of this thesis is to evaluate the influence of ethyl vinyl acetate (EVA) and polyolefin elastomer (POE) encapsulant types on the glass-glass (GG) photovoltaic (PV) module reliability. The influence of these two encapsulant types on the reliability of GG modules was compared with baseline glass-polymer backsheet (GB) modules for a benchmarking purpose. Three sets of modules, with four modules in each set, were constructed with two substrates types i.e. glass-glass (GG) and glass- polymer backsheet (GB); and 2 encapsulants types i.e. ethyl vinyl acetate (EVA) and polyolefin elastomer (POE). Each module set was subjected to the following accelerated tests as specified in the International Electrotechnical Commission (IEC) standard and Qualification Plus protocol of NREL: Ultraviolet (UV) 250 kWh/m2; Thermal Cycling (TC) 200 cycles; Damp Heat (DH) 1250 hours. To identify the failure modes and reliability issues of the stressed modules, several module-level non-destructive characterizations were carried out and they include colorimetry, UV-Vis-NIR spectral reflectance, ultraviolet fluorescence (UVF) imaging, electroluminescence (EL) imaging, and infrared (IR) imaging. The above-mentioned characterizations were performed on the front side of the modules both before the stress tests (i.e. pre-stress) and after the stress tests (i.e. post-stress). The UV-250 extended stress results indicated slight changes in the reflectance on the non-cell area of EVA modules probably due to minor adhesion loss at the cell and module edges. From the DH-1250 extended stress tests, significant changes, in both encapsulant types modules, were observed in reflectance and UVF images indicating early stages of delamination. In the case of the TC-200 stress test, practically no changes were observed in all sets of modules. From the above short-term stress tests, it appears although not conclusive at this stage of the analysis, delamination seems to be the only failure mode that could possibly be affecting the module performance, as observed from UV and DH extended stress tests. All these stress tests need to be continued to identify the wear-out failure modes and their impacts on the performance parameters of PV modules. / Dissertation/Thesis / Masters Thesis Mechanical Engineering 2020