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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

Search results

Showing 1 to 3 of 3 (0.081 seconds)

Spelling suggestions: "subject:"calating additives"" "subject:"calating dditives""

1

Distribution of Electrodeposited Copper on Patterned Substrates in the Presence of Additives: Effects of Periodic Reverse Current and Etching

Lindberg, Erik, Lindberg January 2018 (has links)
No description available.
Chemical Engineering
Copper Electrodeposition
Plating Additives
Electrochemical Modeling
PEG
SPS
Periodic Reverse Pulsing
2

Modeling the Role of Plating Additives in the Metallization of Semiconductor Interconnects: From Dual Damascene to Through Silicon Vias

Adolf, James 01 June 2011 (has links)
No description available.
Chemical Engineering
Copper Electrodeposition
Bottom-Up Fill
Plating Additives
Electrochemical Modeling
3

Additives Screening Techniques and Process Characterization for Electroplating of Semiconductor Interconnects

Boehme, Lindsay Erin 11 June 2014 (has links)
No description available.
Chemical Engineering

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