Spelling suggestions: "subject:"ablating."" "subject:"achelating.""
11 |
Large displacement deformation of plates subject to projectile impactHallett, N. M. January 1987 (has links)
No description available.
|
12 |
Electrodeposition and wear behaviour of tin composite coatingsPomares Siberio, Juan Pedro January 1998 (has links)
No description available.
|
13 |
Electrochemical studies with the quartz crystal microbalance.Gafin, Anthony Harold January 1994 (has links)
A thesis submitted to the Faculty of Science,
University of the Witwatersrand, Johannesburg,
in fulfilment of the requirements for the degree of
Doctor of Philosophy. / A quartz microbalance electrode (QME) was constructed
for the investigation of the electrochemistry of
electroless plating baths. To this end, the electronic
oscillator circuitry required for the microbalance was
developed from literature examples, and the techniques
of forming electrodes and mounting the crystal in an
appropriate holder were established. The device thus
developed was compact, allowing for in situ frequency
and electrochemical measurements to be made in a
commercially available 100 mL Metrohm cell. The
precision .and accuracy obtained with the home-built
device were shown to be adequate for electrochemical
research, and the sensitivity was found to be
consistent with the value expected from the Sauerbrey
equation.(Abbreviation abstract) / Andrew Chakane 2018
|
14 |
A study of linear sweep voltammetric determination of chromium (VI), chromium (III), and sulphate ions in chromium plating solution.January 1984 (has links)
by Yeung Chung Kin. / Bibliography: leaves 105-106 / Thesis (M.Ph.)--Chinese University of Hong Kong, 1984
|
15 |
Electroless Copper Deposition: A Sustainable ApproachKutnahorsky, Marika Renée 30 November 2011 (has links)
A sustainable electroless copper coating process was developed for plating automotive fasteners shaped from AISI 9255 low carbon, high silicon steel. The objective was to minimize the ionic and organic species present in each step of the plating process. A sulfuric acid solution inhibited with quinine was defined to clean the steel prior to plating. The corrosivity of the solution was examined through electrochemical and weight loss measurements to evaluate the efficiency of the cleaning process at high temperatures and high acid concentrations. An electroless copper coating process was then developed using a simple copper sulfate chemistry inhibited with quinine to extend the possible operating window. Finally, benzotriazole was evaluated as a possible anti-oxidant coating. Accelerated thioacetamide corrosion tests were used to evaluate the corrosion inhibition of benzotriazole on copper coatings.
|
16 |
Electroless Copper Deposition: A Sustainable ApproachKutnahorsky, Marika Renée 30 November 2011 (has links)
A sustainable electroless copper coating process was developed for plating automotive fasteners shaped from AISI 9255 low carbon, high silicon steel. The objective was to minimize the ionic and organic species present in each step of the plating process. A sulfuric acid solution inhibited with quinine was defined to clean the steel prior to plating. The corrosivity of the solution was examined through electrochemical and weight loss measurements to evaluate the efficiency of the cleaning process at high temperatures and high acid concentrations. An electroless copper coating process was then developed using a simple copper sulfate chemistry inhibited with quinine to extend the possible operating window. Finally, benzotriazole was evaluated as a possible anti-oxidant coating. Accelerated thioacetamide corrosion tests were used to evaluate the corrosion inhibition of benzotriazole on copper coatings.
|
17 |
Electroless Copper Deposition: A Sustainable ApproachKutnahorsky, Marika Renée 30 November 2011 (has links)
A sustainable electroless copper coating process was developed for plating automotive fasteners shaped from AISI 9255 low carbon, high silicon steel. The objective was to minimize the ionic and organic species present in each step of the plating process. A sulfuric acid solution inhibited with quinine was defined to clean the steel prior to plating. The corrosivity of the solution was examined through electrochemical and weight loss measurements to evaluate the efficiency of the cleaning process at high temperatures and high acid concentrations. An electroless copper coating process was then developed using a simple copper sulfate chemistry inhibited with quinine to extend the possible operating window. Finally, benzotriazole was evaluated as a possible anti-oxidant coating. Accelerated thioacetamide corrosion tests were used to evaluate the corrosion inhibition of benzotriazole on copper coatings.
|
18 |
Electroless Copper Deposition: A Sustainable ApproachKutnahorsky, Marika Renée 30 November 2011 (has links)
A sustainable electroless copper coating process was developed for plating automotive fasteners shaped from AISI 9255 low carbon, high silicon steel. The objective was to minimize the ionic and organic species present in each step of the plating process. A sulfuric acid solution inhibited with quinine was defined to clean the steel prior to plating. The corrosivity of the solution was examined through electrochemical and weight loss measurements to evaluate the efficiency of the cleaning process at high temperatures and high acid concentrations. An electroless copper coating process was then developed using a simple copper sulfate chemistry inhibited with quinine to extend the possible operating window. Finally, benzotriazole was evaluated as a possible anti-oxidant coating. Accelerated thioacetamide corrosion tests were used to evaluate the corrosion inhibition of benzotriazole on copper coatings.
|
19 |
Applications of Electroless Plating and Electrophoretic to Glass Substrate DepositionLin, Shih-Chieh 04 July 2006 (has links)
In this study we present the results of electroless deposition of silver (Ag) and electrophoretic deposition (EPD) of Al2O3 layers on glass for application in thin film transistor (TFT). Since Ag exhibits excellent resistivity, it is selected to be the material of conductive layer. Ag thin film electrical and physical parameters are studied as a function of the deposition time and working temperature. We study the thin-film electrical and mechanical properties using 4-point Probe, surface analyzer and nano indenter. The Ag film, thicker than 200 nm, exhibited a specific electrical sheet resistivity of about 500 m£[/¡¼. We also study the thin-film morphology and composition using SEM and FTIR, respectively. In this study, Mechanism and kinetics of the electrophoretic process in an Al2O3 cell are also studied. Al2O3 concentration levels are set from 1.25 to 7.5%, and deposition time from 5~20 seconds. Deposition time and Al2O3 particle concentration is experimentally discussed and characterized. The result shows that a linear relationship between the deposition rate and applied voltage is obtained. Besides, in this study, deposition of conductive layer silver and insulating layer Al2O3 for TFT are studied. A new process to deposit Ag layer and Al2O3 layer to be the conductivity layer and insulating layer of TFT is presented. First, the circuit pattern is defined by lithography process. Then, Ag is deposited with thickness of 200 nanometers. Second, the wafer is immersed in the stripper solution to remove the resist. After the deposition of the Ag on glass is finished, Al2O3 nano-scale particle concentration is prepared for electrophoretic deposition.
|
20 |
Temperature control and characterization of silicon-germanium growth by rapid thermal chemical vapor deposition /Hwang, Sung-bo, January 2002 (has links)
Thesis (Ph. D.)--University of Texas at Austin, 2002. / Vita. Includes bibliographical references (leaves 163-173). Available also in a digital version from Dissertation Abstracts.
|
Page generated in 0.1011 seconds