Yes / This paper presents a novel on-chip antenna using standard CMOS-technology based on metasurface implemented on two-layers polyimide substrates with a thickness of 500 μm. The aluminium ground-plane with thickness of 3 μm is sandwiched between the two-layers. Concentric dielectric-rings are etched in the ground-plane under the radiation patches implemented on the top-layer. The radiation patches comprise concentric metal-rings that are arranged in a 3 × 3 matrix. The antennas are excited by coupling electromagnetic energy through the gaps of the concentric dielectric-rings in the ground-plane using a microstrip feedline created on the bottom polyimide-layer. The open-ended feedline is split in three-branches that are aligned under the radiation elements to couple the maximum energy. In this structure, the concentric metal-rings essentially act as series left-handed capacitances CL that extend the effective aperture area of the antenna without affecting its dimensions, and the concentric dielectric rings etched in the ground-plane act as shunt left-handed inductors LL, which suppress the surface-waves and reduce the substrates losses that leads to improved bandwidth and radiation properties. The overall structure behaves like a metasurface that is shown to exhibit a very large bandwidth of 0.350–0.385 THz with an average radiation gain and efficiency of 8.15dBi and 65.71%, respectively. It has dimensions of 6 × 6 × 1 mm3 that makes it suitable for on-chip implementation. / This work is partially supported by RTI2018-095499-B-C31, Funded by Ministerio de Ciencia, Innovación y Universidades, Gobierno de España (MCIU/AEI/FEDER,UE), and innovation programme under grant agreement H2020-MSCA-ITN-2016 SECRET-722424 and the fnancial support from the UK Engineering and Physical Sciences Research Council (EPSRC) under grant EP/E022936/1. / Research Development Fund Publication Prize Award winner, March 2020