In This Thesis , We primarily introduce some results with suppression of ground bounce noise in high-speed PCB by the formal researchers and summarize their advantages and weaknesses .In the next section .we explain why the EBG (Electromagnetic Band Gap ) design structure is from PBG (Photonic Band Gap ) concept in optical research field and that its principle can suppress GBN . We also summarize their advantages and weaknesses .In the following part, we define five parameters of EBG design structure to find the optimal solution by HFSS simulation method .The optimal solution can enlarge the bandwidth of suppression of GBN to 5.40GHz.We prove the accuracy of HFSS simulation method by actual measurement . When the EBG basic cell gradually compact from n=9.their characteristics are according to 1.central frequency towards high frequency 2.bandwidth of suppression of GBN is more broadband 3. forbiddance band depth becomes wider. Finally we oppose some new EBG design structures to solve some problems of old EBG design structure .These new EBG design structures can enhance signal integrity (SI) and law frequency response. Include three items 1.Meander design structure 2. Buddha design structure 3. Budder design structure .We also prove the accuracy of HFSS simulation method by actual measurement.

In this thesis, we study the electromagnetic effect of the high-speed digital PCB in three sections. In first section, based on the FDTD modeling approach, the bridging effect of the isolation moat on the EMI caused by the ground bounce noise is investigated. We find that isolating the noise source by slits is effective to eliminate the EMI, but bridges connecting between two sides of the slits will significantly degrade the effect of EMI protection. In second section, we investigate both in time and frequency domains the power plane noise coupling to signal trace with via transition in multi-layered PCB. Separating the power plane with slits is effective in reducing noise coupling in high frequency but a new resonant mode will be excited at lower frequency. Current distribution pattern of this new resonant mode between the power planes helps us to understand this phenomenon more clearly. In final section, by using FDTD link SPICE method, we can predict the electromagnetic behavior of the PCB with active device effectively.