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Diagnostika kovových materiálů / Diagnosis of metallic materialsBuday, Matej January 2010 (has links)
This thesis deals with non-destructive testing (NDT). It Describes two basic thermographic methods, lock-in and pulse thermography. Different types of measurements using Fluke Ti55, points to the possibility of applying these methods in practice. Pulse thermography issue is a substantial part of this work, due to its good applicability. Also, it compares visual testing methods (VIS) and pulse thermography due to measurement with die-casting alloy AC-AlSi9Cu3 (Fe).
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Use of Pulse Thermography for Characterization of Defects in Polymer CompositesKlöckner, Kim January 2023 (has links)
In this project, the possibility of using thermography as a non-destructive testing tool in the manufacturing process of boats and to assess the quality of end-of-life composite structures has been explored. To do so, a literature surview regarding the current applications of thermography and the techniques currently used for quality control in the boats industry has been conducted. Additionally, the set-up of the thermal camera has been improved for the testing and measurements on several composite parts have been performed. Here, the resulting images were analysed regarding different features important for the intended new application, such as existence of delamination, bonding quality, and fibre orientations. The technique appears to be well suited to evaluate the bonding quality in case of glass fibre composite plates and to detect delaminations and other defects in such. Regarding the fibre orientation more studies are needed to judge the practicality.
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Použití termovizní kamery v měřicí technice. / Using the infrared camera in the measuring technique.Jakl, Oldřich January 2013 (has links)
This diploma thesis is focused on using infrared camera within methods of active thermography. The first part of work is an introduction to the passive and active thermography; and about four basic methods of active thermography: step heating themography, Lock-in thermography and pulse phase thermography. The second part is a proposal of experimental working place. There are also presented results of practical implementation pulse and pulse phase methods tested for application of detection of subsurface defect.
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Flash Pulse Thermography Measurements of Coat ThicknessHäggkvist, Alexander January 2023 (has links)
The application of varnish, metal coats, and paint is a common practice for modifying or enhancing material properties. Metal coats are frequently used as protective layers against corrosion, heat, and wear, while also influencing characteristics like conductivity, weight, and production costs. Achieving the optimal thickness of the coating is critical, as a too-thin layer may not offer sufficient protection, while an overly thick layer adds unnecessary weight and increases expenses. Therefore, it is crucial to accurately measure the coating thickness without causing any damage. This project focuses on utilising flash pulse thermography, a non-invasive and non-destructive measuring technique, with three algorithms — Dynamical Thermal Tomography, Power Function, and Pulse Phase Thermography — to measure and differentiate between plates with known variations in the number of coating layers. The study also aims to identify the limiting factors associated with the experimental equipment and the characteristics of the thermography algorithms. The thickness calculations were performed both individually for each plate and simultaneously for multiple plates. The results demonstrate that Dynamical Thermal Tomography exhibits superior precision and strong linear correlation when measuring individual plates. On the other hand, the Power Function algorithm outperforms in effectively distinguishing between two plates simultaneously, while providing decent precision for individual plates. It is worth noting that the framerate of the camera significantly affects the performance and serves as the primary limiting factor in this specific experimental setup.Further investigations are necessary to obtain more conclusive results and determine the limitations of accuracy when measuring coating thickness.
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Transiente Methoden der Infrarot-Thermografie zur zerstörungsfreien Fehleranalytik in der mikroelektronischen Aufbau- und Verbindungstechnik / Transient methods of infrared thermography for nondestructive failure analysis in microelectronic packagingMay, Daniel 20 March 2015 (has links) (PDF)
In dieser Arbeit wurde eine neue fehleranalytische Methode zur industriellen Anwendung an neuen Technologien der Aufbau- und Verbindungstechnik entwickelt. Das Verfahren basiert auf der Wechselwirkung von thermischen Wellen und Defekten.
Die Besonderheit ist dabei die Zerstörungsfreiheit, die Geschwindigkeit, das Auflösungsvermögen und die durch neueste IR-Detektoren erreichte Temperaturempfindlichkeit.
Es wurden grundlegende Studien bezüglich Auflösung und parasitären Effekten bei der Anwendung unter industriellen Randbedingungen durchgeführt. Dabei wurde eine systematische Vorgehensweise bezüglich der Komplexität gewählt.
Dies ermöglicht nun u.a. eine Vorhersage der zu erwartenden Prüfdauer zur Auflösung vergrabener Defekte, der Begrenzung der maximalen Anregungsimpulsbreite (bei gegebener Defekttiefe) und die quantitative Ermittlung des Einflusses einer Lackschicht.
Methodisch kamen grundsätzlich Simulationen und vergleichende Experimente zum Einsatz. Es wurden spezielle Proben zur Isolierung und Klärung parasitärer Effekte verwendet. Letztlich konnte das Messsystem erfolgreich an industriellen Problemstellung demonstriert werden.
Das entwickelte Messsystem zeichnet sich durch hohe Flexibilität aus. Verschiedene problemangepasste Anregungsquellen (interne und externe Anregung durch zahlreiche physikalische Effekte) kommen zum Einsatz.
Das Messsystem besteht aus vier Hauptmodulen, der Differenzbild-Methode, der Impulsthermografie, und zwei Varianten der LockIn-Thermografie.
Zusammen ist das System in der Lage, Voids, Delaminationen und Risse in verschiedenen Bereichen auch der modernen AVT sicher zu erkennen.
Es werden dabei Temperaturauflösugnen bis zu 5 mK und laterale Auflösungen bis 17 µm erreicht.
Diese Arbeit legt einen Grundstein für die Anwendung der thermischen Fehleranalytik in der Industrie, indem hier die Grenzen der IR-Messtechnik aufgezeigt und charakterisiert werden. / In this work a new failure analytical method for the industrial application of new technologies in electronic packaging has been developed.
The developed method is based on the interaction of the thermal waves and defects.
The special fature is non-destructive, speed, resolution and high temperature sensitivity due to latest IR-detectors.
It fundamental studies regarding resolution and parasitic effects in the application were carried out cinsidering industrial conditions. Here, a systematic approach regarding the complexity has been selected.
This now enables a prediction of the expected test period for detecting buried defects, limits for excitation pulse width (for a given defect depth) and the quantitative determination of the influence of parasitic paints.
Methodically always simulations and comparative experiments were used. Simple samples for the isolation and purification of parasitic effects has been used. Finally, the measurement system has been successfully demonstrated on an industrial applications.
The developed measurement system is characterized by high flexibility. Different problem-adapted excitation sources (internal and external excitation by numerous physical effects) are used.
The measurement system currently consists of four main modules, the difference image method, the pulse thermography, and two variants of LockIn-thermography. Together, the system is capable of detecting voids, delaminations and cracks in various fields of electronic packageing.
It will reach temperature resolutions up to 5 mK and lateral resolutions down to 17 µm.
This work stes a foundation for the application of thermal failure analysis for industry by showing and charcterization the limits of IR imaging.
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Transiente Methoden der Infrarot-Thermografie zur zerstörungsfreien Fehleranalytik in der mikroelektronischen Aufbau- und VerbindungstechnikMay, Daniel 10 March 2015 (has links)
In dieser Arbeit wurde eine neue fehleranalytische Methode zur industriellen Anwendung an neuen Technologien der Aufbau- und Verbindungstechnik entwickelt. Das Verfahren basiert auf der Wechselwirkung von thermischen Wellen und Defekten.
Die Besonderheit ist dabei die Zerstörungsfreiheit, die Geschwindigkeit, das Auflösungsvermögen und die durch neueste IR-Detektoren erreichte Temperaturempfindlichkeit.
Es wurden grundlegende Studien bezüglich Auflösung und parasitären Effekten bei der Anwendung unter industriellen Randbedingungen durchgeführt. Dabei wurde eine systematische Vorgehensweise bezüglich der Komplexität gewählt.
Dies ermöglicht nun u.a. eine Vorhersage der zu erwartenden Prüfdauer zur Auflösung vergrabener Defekte, der Begrenzung der maximalen Anregungsimpulsbreite (bei gegebener Defekttiefe) und die quantitative Ermittlung des Einflusses einer Lackschicht.
Methodisch kamen grundsätzlich Simulationen und vergleichende Experimente zum Einsatz. Es wurden spezielle Proben zur Isolierung und Klärung parasitärer Effekte verwendet. Letztlich konnte das Messsystem erfolgreich an industriellen Problemstellung demonstriert werden.
Das entwickelte Messsystem zeichnet sich durch hohe Flexibilität aus. Verschiedene problemangepasste Anregungsquellen (interne und externe Anregung durch zahlreiche physikalische Effekte) kommen zum Einsatz.
Das Messsystem besteht aus vier Hauptmodulen, der Differenzbild-Methode, der Impulsthermografie, und zwei Varianten der LockIn-Thermografie.
Zusammen ist das System in der Lage, Voids, Delaminationen und Risse in verschiedenen Bereichen auch der modernen AVT sicher zu erkennen.
Es werden dabei Temperaturauflösugnen bis zu 5 mK und laterale Auflösungen bis 17 µm erreicht.
Diese Arbeit legt einen Grundstein für die Anwendung der thermischen Fehleranalytik in der Industrie, indem hier die Grenzen der IR-Messtechnik aufgezeigt und charakterisiert werden. / In this work a new failure analytical method for the industrial application of new technologies in electronic packaging has been developed.
The developed method is based on the interaction of the thermal waves and defects.
The special fature is non-destructive, speed, resolution and high temperature sensitivity due to latest IR-detectors.
It fundamental studies regarding resolution and parasitic effects in the application were carried out cinsidering industrial conditions. Here, a systematic approach regarding the complexity has been selected.
This now enables a prediction of the expected test period for detecting buried defects, limits for excitation pulse width (for a given defect depth) and the quantitative determination of the influence of parasitic paints.
Methodically always simulations and comparative experiments were used. Simple samples for the isolation and purification of parasitic effects has been used. Finally, the measurement system has been successfully demonstrated on an industrial applications.
The developed measurement system is characterized by high flexibility. Different problem-adapted excitation sources (internal and external excitation by numerous physical effects) are used.
The measurement system currently consists of four main modules, the difference image method, the pulse thermography, and two variants of LockIn-thermography. Together, the system is capable of detecting voids, delaminations and cracks in various fields of electronic packageing.
It will reach temperature resolutions up to 5 mK and lateral resolutions down to 17 µm.
This work stes a foundation for the application of thermal failure analysis for industry by showing and charcterization the limits of IR imaging.
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