abstract / Electrical and Electronic Engineering / Doctoral / Doctor of Philosophy

Hu Mengna. / Thesis (M.Phil.)--Chinese University of Hong Kong, 2004. / Includes bibliographical references (leaves 102-105). / Abstracts in English and Chinese. / Abstract --- p.ii / Acknowledgements --- p.iv / Table of Contents --- p.v / Chapter Chapter 1 --- Introduction --- p.1 / Chapter 1.1 --- PEEC Modeling Method --- p.1 / Chapter 1.2 --- Overview of the work --- p.2 / Chapter 1.3 --- Original Contributions --- p.3 / Chapter 1.4 --- Organization of the thesis --- p.3 / Chapter Chapter 2 --- CLASSICAL PARTIAL ELEMENT EQUIVALENT CIRCUIT MODELING --- p.4 / Chapter 2.1 --- Introduction --- p.4 / Chapter 2.2 --- Mathematical Formulation in PEEC --- p.5 / Chapter 2.2.1 --- Basic Integral Equation --- p.5 / Chapter 2.2.2 --- Current and Charge discretization --- p.6 / Chapter 2.2.3 --- Galerkin Matching Method --- p.8 / Chapter 2.3 --- Partial Inductance --- p.10 / Chapter 2.3.1 --- General Formula for partial mutual inductance --- p.10 / Chapter 2.3.2 --- Mutual Inductance between two Thin Rectangular Tapes --- p.11 / Chapter 2.4 --- Partial Capacitance --- p.13 / Chapter 2.4.1 --- General Formula for partial mutual capacitance --- p.13 / Chapter 2.4.2 --- Mutual Capacitance Between Two Thin Rectangular Tapes --- p.16 / Chapter 2.5 --- Meshing Scheme --- p.17 / Chapter 2.6 --- Green's function --- p.20 / Chapter 2.6.1 --- Modification on free space Green's function through Ray-tracing technique --- p.20 / Chapter 2.6.2 --- Impact on partial inductance and partial capacitance --- p.22 / Chapter 2.7 --- PEEC Modeling of A LTCC 2.4GHz Band Pass Filter --- p.23 / Chapter 2.7.1 --- General Procedures to apply PEEC Modeling Method --- p.23 / Chapter 2.7.2 --- Numerical Results of a LTCC Band Pass Filter Modeling --- p.24 / Chapter 2.8 --- Summary --- p.27 / Chapter Chapter 3 --- GENERALIZED PEEC MODELING FOR PASSIVE COMPONENT OF IRREGULAR SHAPES --- p.29 / Chapter 3.1 --- Introduction --- p.29 / Chapter 3.2 --- Triangular meshing scheme in MoM --- p.30 / Chapter 3.2.1 --- Triangular meshing scheme adopted in MoM --- p.30 / Chapter 3.2.2 --- Spiral Inductor --- p.32 / Chapter 3.3 --- Generalized Meshing Scheme --- p.34 / Chapter 3.4 --- Mathematical Formulation in Enhanced PEEC --- p.39 / Chapter 3.4.1 --- Current and Charge discretization --- p.39 / Chapter 3.4.2 --- Enhanced Formulation for partial mutual inductance and capacitance --- p.41 / Chapter 3.4.3 --- Four-Dimensional Integration --- p.43 / Chapter 3.4.4 --- Gauss Numerical Integration --- p.44 / Chapter 3.4.5 --- Mixed Numerical and Analytical Technique --- p.47 / Chapter 3.5 --- Numerical Results from Enhanced PEEC Modeling Method --- p.50 / Chapter 3.5.1 --- Spiral Inductor --- p.50 / Chapter 3.5.2 --- High Pass Filter --- p.56 / Chapter 3.5.3 --- Design and Optimization of LTCC Diplexer --- p.60 / Chapter 3.6 --- Summary --- p.67 / Chapter Chapter 4 --- HIGH FREQUENCY PEEC --- p.69 / Chapter 4.1 --- Introduction --- p.69 / Chapter 4.2 --- Spatial Domain Green's Functions --- p.70 / Chapter 4.2.1 --- Full-wave Spectral Domain Green´ةs Functions --- p.70 / Chapter 4.2.2 --- Full-wave Spatial Domain Green，s functions --- p.72 / Chapter 4.3 --- Frequency-dependent Complex Partial Elements --- p.74 / Chapter 4.4 --- Numerical Results Of High-Frequency PEEC Modeling Method --- p.79 / Chapter 4.4.1 --- Numerical Discussion of Complex Image Method --- p.75 / Chapter 4.4.2 --- Microstrip Filter --- p.84 / Chapter 4.4.3 --- Patch Antenna --- p.84 / Chapter 4.5 --- Summary --- p.87 / Chapter Chapter 5 --- CONCLUDING REMARKS --- p.88 / Chapter 5.1 --- Two Enhancements in PEEC Modeling --- p.88 / Chapter 5.2 --- Limitations of Enhanced PEEC Modeling --- p.90 / Chapter 5.3 --- Future Work --- p.90 / APPENDIX --- p.92 / REFERENCE --- p.102

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by Yeung, Lap Kun. / Thesis (M.Phil.)--Chinese University of Hong Kong, 2002. / Includes bibliographical references (leaves 96-98). / Abstracts in English and Chinese. / Abstract --- p.ii / Acknowledgements --- p.iv / Table of Contents --- p.v / Chapter 1 --- Introduction --- p.1 / Chapter 1.1 --- Emergence of LTCC Technology --- p.1 / Chapter 1.2 --- Overview of the Work --- p.2 / Chapter 1.3 --- Original Contributions --- p.3 / Chapter 1.4 --- Thesis Organization --- p.4 / Chapter 2 --- Fundamentals of Partial Element Equivalent Circuit Modeling --- p.5 / Chapter 2.1 --- Introduction --- p.5 / Chapter 2.2 --- PEEC Formulation --- p.6 / Chapter 2.2.1 --- Mixed potential integral equation --- p.6 / Chapter 2.2.2 --- Current discretization --- p.7 / Chapter 2.2.3 --- Charge discretization --- p.8 / Chapter 2.2.4 --- Galerkin matching --- p.9 / Chapter 2.3 --- Partial Inductance --- p.11 / Chapter 2.4 --- Partial Capacitance --- p.12 / Chapter 2.5 --- Meshing Scheme and Circuit Interpretation --- p.13 / Chapter 2.6 --- Summary --- p.15 / Chapter 3 --- PEEC Modeling of LTCC RF Circuits using Thin-film Approximation --- p.16 / Chapter 3.1 --- Introduction --- p.16 / Chapter 3.2 --- A Simple LTCC Band-pass Filter --- p.17 / Chapter 3.3 --- Discretization Scheme --- p.18 / Chapter 3.4 --- Quasi-static Green's Functions --- p.21 / Chapter 3.4.1 --- Free-space Green's function --- p.21 / Chapter 3.4.2 --- System with a single ground plane --- p.22 / Chapter 3.4.3 --- System with two ground planes --- p.25 / Chapter 3.5 --- Complex-Image Analysis --- p.25 / Chapter 3.6 --- Partial Inductance --- p.31 / Chapter 3.6.1 --- Strip-to-strip inductance --- p.31 / Chapter 3.6.2 --- System with one or more ground planes --- p.33 / Chapter 3.7 --- Partial Capacitance --- p.34 / Chapter 3.8 --- Numerical and Experimental Results --- p.37 / Chapter 3.9 --- Summary --- p.40 / Chapter 4 --- PEEC Modeling of LTCC RF Circuits using Thin-film Approximation (Via-hole Modeling) --- p.41 / Chapter 4.1 --- Introduction --- p.41 / Chapter 4.2 --- Via-hole Modeling --- p.42 / Chapter 4.2.1 --- Discretization scheme --- p.42 / Chapter 4.2.2 --- Inductance formulae --- p.43 / Chapter 4.2.3 --- Empirical formula --- p.46 / Chapter 4.2.4 --- Edge-effect compensation --- p.48 / Chapter 4.3 --- Numerical and Experimental Results --- p.49 / Chapter 4.4 --- Summary --- p.51 / Chapter 5 --- An Efficient PEEC Algorithm for Modeling of LTCC RF Circuits with Finite Metal Strip Thickness --- p.53 / Chapter 5.1 --- Introduction --- p.53 / Chapter 5.2 --- PEEC Modeling using Thin-film Approximation --- p.54 / Chapter 5.3 --- PEEC Modeling with Finite Metal Thickness --- p.55 / Chapter 5.4 --- Edge-effect Compensation in Inductance Calculation --- p.57 / Chapter 5.5 --- Numerical and Experimental Results --- p.61 / Chapter 5.6 --- Summary --- p.65 / Chapter 6 --- A Compact Second-order LTCC Band-pass Filter with Two Finite Transmission Zeros --- p.66 / Chapter 6.1 --- Introduction --- p.66 / Chapter 6.2 --- Features of the Filter --- p.67 / Chapter 6.3 --- Design Theory --- p.68 / Chapter 6.4 --- LTCC Filter Implementation --- p.70 / Chapter 6.4.1 --- Circuit model --- p.70 / Chapter 6.4.2 --- Physical layout --- p.73 / Chapter 6.5 --- Experimental Results --- p.75 / Chapter 6.6 --- Summary --- p.77 / Chapter 7 --- Concluding Remarks --- p.79 / Chapter 7.1 --- PEEC Modeling --- p.79 / Chapter 7.2 --- Limitations of the Algorithm --- p.80 / Chapter 7.3 --- Further Improvements --- p.81 / Appendix --- p.82 / References --- p.96 / Author's Publications --- p.98

Gamma-TiAl is an ordered intermetallic compound characterized by high strength to density ratio, good oxidation resistance, and good creep properties at elevated temperatures. However, it is intrinsically brittle at room temperature. This thesis investigates the potential for the use of grinding to process TiAl into useful shapes. Grinding is far from completely understood, and many aspects of the individual mechanical interactions of the abrasive grit with the material and their effect on surface integrity are unknown. The development of new synthetic diamond superabrasives in which shape and size can be controlled raises the question of the influence of those variables on the surface integrity. The goal of this work is to better understand the fundamentals of the abrasive grit/material interaction in grinding operations. Experimental, analytical, and numerical work was done to characterize and predict the resultant deformation and surface integrity on ground lamellar gamma-TiAl. Grinding tests were carried out, by analyzing the effects of grit size and shape, workpiece speed, wheel depth of cut, and wear on the subsurface plastic deformation depth (PDD). A practical method to assess the PDD is introduced based on the measurement of the lateral material flow by 3D non-contact surface profilometry. This method combines the quantitative capabilities of the microhardness measurement with the sensitivity of Nomarski microscopy. The scope and limitations of this technique are analyzed. Mechanical properties were obtained by quasi-static and split Hopkinson bar compression tests. Residual stress plots were obtained by x-ray, and surface roughness and cracking were evaluated. The abrasive grit/material interaction was accounted by modeling the force per abrasive grit for different grinding conditions, and studying its correlation to the PDD. Numerical models of this interaction were used to analyze boundary conditions, and abrasive size effects on the PDD. An explicit 2D triple planar slip crystal plasticity model of single point scratching was used to analyze the effects of lamellae orientation, material anisotropy, and grain boundaries on the deformation.