In this article, we report the study of defects between single and bulk GaN nanorods in temperature dependence. High quality of GaN nanorods have been investigated by £g-photoluminescence. Optical properties and surface morphology have been analyzed by a series of measurements, including field-emission electron microscopy (FESEM), and cathodoluminescence (CL). CL data reveal that the intensity of surface state emission is larger than near-band-edge emission at 20K . The 3.21eV peak reveals the structural defect at GaN/Si interface. The surface state emission from bottom is larger than top.

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Abstract This research describes the value chain development of Taiwan foundry industry¡¦s investment in China and analyzes how the foundry firm establishes its value chain and strategy in the different industry environment. The research also raises inferences about Taiwan foundry industry¡¦s value-chain mode and business model and expects to be reference materials for the industry and government. The research content includes the analysis of Taiwan and China semi-conductor industries¡¦ environment, the analysis of the industry value chain, and the scenario analysis of China¡¦s industry environment and Taiwan¡¦s foundry industry de velopment. Finally, here come the research findings of this thesis: 1. The foundry industry in Taiwan already established a stable competitive advantage. After investing in China, it will also play a key role in the development of China¡¦s semi-conductor industries. 2. Taiwan foundry industry will be the coordinator of China¡¦s semi-conductor industry value-chain, and promote the development there. 3. There exist the demand and trend which the foundry industry will raise its added value in the semi-conductor industry value-chain, especially after investing in China. 4. When the foundry industry tries to raise its added value, some activities like IP providing and IC design service will be the optimum alternatives. 5. After investing in China, the development of the foundry industry will be highly related to the progress of local system industry and IC design industry. 6. No matter how industry environment evolve, the foundry industry will change its value chain structure on the basis of reducing the transaction cost and developing the synergy. 7. The foundry industry won¡¦t do the real integration unless the foundry¡¦s potential profit be limited or the real integration can bring the huge profit. 8. No matter integrate or not, the foundry industry shouldn¡¦t compete with its customer. 9. The foundry industry establish a symbiosis system with its customer, but it will form the different strategies depend the customer classification.

The Chemical-mechanical polishing (CMP) process is now widely employed in the ultralarge scale integration chip fabrication. Due to the continuous advances in semiconductor fabrication technology and decreasing sub-micron feature size, the characterization of erosion, which affects circuit performance and manufacturing throughput, has been an important issue in Cu CMP. In this paper, the erosion in Cu CMP is divided into two levels. The wafer-level and die-level erosion models were developed based on the material removal rates and the geometry of incoming wafers to the Cu CMP process, including the Cu interconnect area fraction, linewidth and Cu deposition thickness. Experiments were conducted to obtain the selectivity values between the Cu, barrier layer and dielectric, and the values of within-wafer material removal rate ratio, β, for the validation of the new erosion model. It was compared with the existing models and was found to agree better with the experimental data. / Singapore-MIT Alliance (SMA)

Semi-conductor industry relies heavily on silicon (Si). However, Si is not a direct-band gap semi-conductor. Consequently, Si does not possess great versatility for multi-functional applications in comparison with the direct band-gap III-V semi-conductors such as GaAs. To bridge this gap, what is ideally required is a semi-conductor material system that is based on silicon, but has significantly greater versatility. While sparsely studied, the semi-conducting silicides material systems offer great potential. Thus, I focused on the growth and structural characterization of ruthenium silicide and osmium silicide material systems. I also characterized iron silicon germanide films using extended x-ray absorption fine structure (EXAFS) to reveal phase, semi-conducting behavior, and to calculate nearest neighbor distances. The choice of these silicides material systems was due to their theoretically predicted and/or experimentally reported direct band gaps. However, the challenge was the existence of more than one stable phase/stoichiometric ratio of these materials. In order to possess the greatest control over the growth process, molecular beam epitaxy (MBE) has been employed. Structural and film quality comparisons of as-grown versus annealed films of ruthenium silicide are presented. Structural characterization and film quality of MBE grown ruthenium silicide and osmium silicide films via in situ and ex situ techniques have been done using reflection high energy electron diffraction, scanning tunneling microscopy, atomic force microscopy, cross-sectional scanning electron microscopy, x-ray photoelectron spectroscopy, and micro Raman spectroscopy. This is the first attempt, to the best of our knowledge, to grow osmium silicide thin films on Si(100) via the template method and compare it with the regular MBE growth method. The pros and cons of using the MBE template method for osmium silicide growth are discussed, as well as the structural differences of the as-grown versus annealed films. Future perspectives include further studies on other semi-conducting silicides material systems in terms of growth optimization and characterization.

No / The reversible in situ formation of a self-assembly building block (naphthalenediimide (NDI)–dipeptide conjugate) by enzymatic condensation of NDI-functionalized tyrosine (NDI-Y) and phenylalanine-amide (F-NH2) to form NDI-YF-NH2 is described. This coupled biocatalytic condensation/assembly approach is thermodynamically driven and gives rise to nanostructures with optimized supramolecular interactions as evidenced by substantial aggregation induced emission upon assembly. Furthermore, in the presence of di-hydroxy/alkoxy naphthalene donors, efficient charge-transfer complexes are produced. The dynamic formation of NDI-YF-NH2 and electronic and H-bonding interactions are analyzed and characterized by different methods. Microscopy (TEM and AFM) and rheology are used to characterize the formed nanostructures. Dynamic nanostructures, whose formation and function are driven by free-energy minimization, are inherently self-healing and provide opportunities for the development of aqueous adaptive nanotechnology.

半導體產業在近二十年來一直在我國經濟發展舞台上扮演積極重要的角色，其績效自然是研究者欲探索之重點。在管理會計頗有作用的作業制成本制度，其提供不同於以往傳統成本制度之資訊，在在替全球知名企業創造更具優勢的管理績效。本研究之重心即在：以深入訪談及田野實證研究方式探討半導體公司導入作業制成本制度後，所發生的績效變化、變化時間與相關資訊，用實證資料檢視作業制成本制度與公司實際經營績效之間的關係，為作業制成本制度在企業之成效作一較為完整且具實務運用的描述，進而提供後續推行作業制成本制度之研究價值，並給予實務界導入作業制成本制度之相關資訊，以作為我國企業推動作業制成本管理制度之參考。 　　本研究以田野實證之資料為主，並以迴歸方式驗證作業制成本資訊釋出前後對企業生產成本與品質之影響，實證結果顯示成本會隨資訊釋出而降低，品質則不會有所變化，表示作業制成本制度確實可以幫助管理者從事成本抑減之工作；也得到品質不會在短期內改善之結論，暗示作業制成本制度之財務績效先於品質績效，資訊使用者之熟練程度差異可能影響績效之出現與否。 　　基於研究所得結論，本研究建議個案公司可以將成本下降之經驗擴散至全廠區，藉由新制度教育員工成本與獲利觀念，並針對員工之使用感想修正個案公司之作業制成本制度。同時也建議未來的研究者，對品質與作業制成本制度甚至成本之關係，作更進一步之研究。 / Using field study method, this study focuses on the relationship between the manufacturing performance of the semi-conductor industry and activity-based costing system information. The analysis suggests that with better decision based on activity and cost driver information, the actvity-based costing information will reduce manufacturing costs while leave quality unchanged. 　　In conclusion, empirical results reveal that manufacturing costs actually decrease with the release of activity-based costing information, while manufacturing quality remains the same. The finding shows that the release of activity-based costing information can reduce the manufacturing costs, but there may not be an immediate effect of quality improvement, suggesting that cost can actually be improved by the activity-based costing system, and quality may need more time and skill toward activity-based costing to change.

L'éco-conception est un processus permettant aux entreprises industrielles d'assumer leur responsabilité relative aux impacts générés par leurs produits. Les contraintes liées aux impacts environnementaux sont intégrées dans les stades avancés de la conception. Du fait de ses spécificités, tant au niveau de la structure du produit que de la complexité des processus de conception, l'industrie microélectronique s'est trouvée jusqu'alors en marge de considérations avancées sur l'impact de ses produits. L'objectif du travail de recherche est de définir une méthodologie d'éco-conception dédiée à la microélectronique permettant d'identifier les méthodes, outils et indicateurs susceptibles d'être déployés dans les départements de R&D. La stratégie associée vise à accroître la sensibilité environnementale des concepteurs et à les conduire à trouver des alternatives influant positivement sur l'environnement. Notre méthodologie repose sur une plateforme méthodologique intégrant plusieurs outils, chacun dédié à une activité indépendante de la conception de produits microélectroniques. L'évaluation environnementale est basée sur l'analyse de cycle de vie (ACV). Dans les phases préliminaires de conception, la connaissance du produit (structure, propriétés et performances) est limitée, alors la modélisation de son cycle de vie est réalisée à l'aide « d'ACV-simplifiée » : cela consiste à prédire l'impact d'un produit en développement grâce à des mécanismes d'adaptation par analogie basés sur l'étude des générations précédentes. En plus de solutions techniques appropriées, l'intégration de l'éco-conception dans une entreprise nécessite certains changements organisationnels : une modification du processus de conception a été proposée ainsi que des recommandations pour l'intégration d'un système de gestion de l'environnement orienté sur les produits. / Eco-design represents a natural process for industries wishing to fulfil their role in safeguarding environment and resources. The constraint linked to impacts becomes a decisive factor which can be systematically integrated in the early stages of products development. Because of chips specificities, both in structure and complexity of design process, microelectronic industry has been up to now out of advanced considerations related to chips environnemental performances. Our target was to define an eco-design methodology dedicated to microelectronic sector including the identification of methods, tools and indicators which have the highest chance to be deployed in R&D departments. The strategy aims to increase designers' environmental consciousness and drive them to explore innovative opportunities that can positively impact the environment during design phase. Our methodology relies on a platform integrating three tools, each one of them dedicated to a part of chip design. Environmental analysis is based on Life Cycle Assessment (LCA). In the preliminary stages of design, knowledge on product (structure, properties and performances) is limited so the evaluation is assessed using “Quick LCA”: it consists in predicting the environmental footprint of an under-development product thanks to adaptive mechanism based on the evaluation of previous generations. In addition to technical solutions, an optimized integration of an innovative process such as eco-design requires organizational changes into the company: a proposal for internal design process modification was done including recommendations for integration of a product-oriented management system.

<p> This thesis deals with the theory and application of semi-conductor detectors to timing measurements. The theory section discusses the charge collection times in the coaxial detector. The third chapter describes the experimental procedure for the γ-γ coincidence work, and the fourth part reports the results of studies of the timing characteristics of the coaxial detector.</p> / Thesis / Master of Science (MSc)

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