Global ETD Search

11	Advanced processing methods for microelectronics industry silicon wafer handling components / Wang, Hongyun, January 1999 (has links) Thesis (Ph. D.)--University of Texas at Austin, 1999. / Vita. Includes bibliographical references (leaves 147-156). Available also in a digital version from Dissertation Abstracts.
12	Analysis, design, and measurement of on-wafer transmission line test structures / Friar, Robert James, January 2000 (has links) Thesis (Ph. D.)--University of Texas at Austin, 2000. / Vita. Includes bibliographical references (leaves 177-181). Available also in a digital version from Dissertation Abstracts.
13	Investigation of an in-situ method for determining the modulation transfer function and its applications in a microlithographic wafer stepper / Carlson, Steven D. January 1990 (has links) Thesis (M.S.)--Rochester Institute of Technology, 1990. / Spine title: In-situ method for determining modulation transfer. Includes bibliographical references (leaves 56-60.).
14	Electrochemical etch characteristics of (100) silicon in tetramethyl ammonium hydroxide Watts, Paul E. 12 November 2002 (has links) A study of potentiostatic and galvanostatic electrochemical etching of silicon in tetramethylammonium hydroxide (TMAH) has been carried out. In TMAH baths,, we find that biased (100) silicon etch rates increase 21% over OCP etch rates. For TMAH baths seasoned with silicon, biased silicon etch rates increase to 63% over those at OCP. Electrochemical etching eliminates the growth of hillocks on etching surfaces regardless of etchant pH, [TMAH] or silicon loading, resulting in highly smooth etching surfaces. Potentiostatic and galvanic etching yield similar etch rates and surface consistency. / Graduation date: 2003 Silicon -- Surfaces -- Etching Semiconductor wafers -- Etching
15	Non-invasive thermal profiling of silicon wafer surface during RTP using acoustic and signal processing techniques / Syed, Ahmed Rashid, January 2000 (has links) Thesis (Ph. D.)--University of Texas at Austin, 2000. / Vita. Includes bibliographical references (leaves 104-108). Available also in a digital version from Dissertation Abstracts.
16	Study on the curing process of no-flow and wafer level underfill for flip-chip applications Zhang, Zhuqing, January 2003 (has links) (PDF) Thesis (Ph. D.)--School of Materials Science and Engineering, Georgia Institute of Technology, 2004. Directed by C.P. Wong. / Includes bibliographical references (leaves 275-289).
17	Electrical parameter control for semiconductor manufacturing Schoene, Clare Butler, January 1900 (has links) Thesis (Ph. D.)--University of Texas at Austin, 2007. / Vita. Includes bibliographical references and index.
18	Effect of dislocation density on residual stress in polycrystalline silicon wafers Garcia, Victoria. January 2008 (has links) Thesis (M. S.)--Mechanical Engineering, Georgia Institute of Technology, 2008. / Committee Chair: Danyluk, Steven; Committee Member: Melkote, Shreyes; Committee Member: Rohatgi, Ajeet.
19	On-chip probe metrology / Farner, William Robert. January 2008 (has links) Thesis (M.S.)--Rochester Institute of Technology, 2008. / Typescript. Includes bibliographical references (leaves 73-75).
20	Laser processing optimization for semiconductor based devices / Sun, Yunlong, January 1997 (has links) Thesis, (Ph. D.)--Oregon Graduate Institute of Science and Technology, 1997.

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