The operating characteristics of non-volatile memory for modern requirement are high-density , low power consumption, fast read and write speed, and good reliability. The floating gate memory generated leakage path in the tunnel oxide during the trend of scaling down, which will result in the loss of all stored charge to the silicon substrate. As the data retention time and endurance are taken into consideration, the thickness of tunnel oxide exist a physical limit, owing to the demand of high-density capacities. RRAM is offered as an option in the next generation non-volatile memories, due to the following advantages: (1) simple structure and easy to process, and low cost ; (2) less restrictive in the scaling-down process; (3) with the multi-bit data storage features; (4) high speed operation; (5) Repeat write and read is more than one million. In the thesis, we use a simple and low-temperature process to form the silicon germanium oxide (Si-Ge-O) RRAM and silicon germanium oxide RRAM with nitrogen doping between the electrode and silicon-germanium oxide interface. By sputtering at argon and oxygen (Ar/O2), and sputtering at argon and ammonia (Ar/NH3) with silicon-germanium target to form silicon germanium oxide RRAM and silicon germanium oxide (Si-Ge-O)/silicon germanium oxnitride (Si-Ge-O-N) RRAM. By informing a SiGeON layer between the interface of electrode and silicon-germanium oxide improve the stability of write voltage and endurance reliability. In addition, both silicon and germanium are useful as materials in the optoelectronics industry and extensively studied in material science. Based on the two materials, the smiting characterizations of RRAM will be improved in the read-write stability and operation reliability.