A novel large-scale silicon system platform with 9.6cm² of active silicon interposer area is demonstrated. The platform contains three interposer tiles and two silicon bridges, and a novel self-alignment technology utilizing positive self-alignment structures (PSAS) and a novel mechanically flexible interconnect (MFI) technology are developed and used to align and interconnect tiles and bridges on an FR4 substrate. An accurate alignment < 8μm between silicon bridges and interposer tiles makes it possible to accommodate nanophotonics to enable a high bandwidth and low-energy system in the future. In addition, mechanically flexible interconnects and silicon bridges are used to provide electrical connections between interposer tiles without having to use motherboard-level interconnects. Finally, an elastomeric bump interposer is developed to enable the packaging of PSAS-enabled silicon systems, and PSAS' compatibility with a thermo-compression bonding process is demonstrated to enable a wide range of system configurations involving interposer tiles and bridges, including the multi-chip package configuration used with the elastomeric bump interposers.