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  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.

Search results

Showing 1 to 10 of 118 (0.126 seconds)

Spelling suggestions: "subject:"folder anda solder"" "subject:"folder ando solder""

1

An experimental study on voids in area array devices for mixed alloy assemblies

Bruno, Felix. January 2006 (has links)
Thesis (Ph. D.)--State University of New York at Binghamton, Systems Science Dept., 2006. / Includes bibliographical references.
Solder and soldering.
2

Implementation of a conformal solder mask system /

Bolek, Mark Francis, January 1993 (has links)
Report (M.S.)--Virginia Polytechnic Institute and State University. M.S. 1993. / Vita. Abstract. Includes bibliographical references (leaves 66-67). Also available via the Internet.
Solder and soldering.
3

Lead-free wave soldering of "thick" PCB using Sn 3.8% Ag 0.07% Cu and no-clean voc-free flux

Mukherjee, Shantanu. January 2007 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Industrial and Systems Engineering Dept., 2007. / Includes bibliographical references.
Solder and soldering.
4

Phenomenological modeling of the deformation behavior of solders

Scott, Daniel T. 05 1900 (has links)
No description available.
Solder and soldering
Deformations (Mechanics)
5

An approach for impression creep of lead-free microelectronic solders /

Anastasio, Onofrio A. January 2002 (has links) (PDF)
Thesis (M.S. in Mechanical Engineering)--Naval Postgraduate School, June 2002. / Thesis advisor(s): Indranath Dutta. Includes bibliographical references (p. 37-38). Also available online.
6

Comparison of thermal fatigue reliability between SAC and SnPb solders under various stress range conditions /

Yang, Chaoran. January 2009 (has links)
Includes bibliographical references (p. 80-84).
7

Role of intermetallics for both tin-lead and lead free solder structures and its solder pad combination

Iyer, Ganesh R. January 2005 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Mechanical Engineering Dept., 2005. / Includes bibliographical references.
8

A Study of the Processing Properties of Hard-Particle Reinforced Composite Solders

Calderon, Jose Guadalupe 05 1900 (has links)
The microstructural, mechanical and thermal properties of various composite solder formulations were investigated. Special interest was given in observing the processing properties, microstructural characteristics, fatigue behavior, tensile strength, and the effect of environmental ageing on the composite solder formulations. The solderability parameters wetting and speed of soldering, reflow temperature, and the thermal stability of the resulting composite solder were also examined.
solder
chemistry
Solder and soldering.
9

Micro impact fatigue testing of solder joints

Guruprasad, Pradosh. January 2008 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Materials Science and Engineering Program, 2008. / Includes bibliographical references.
10

Soldering in high pressure die casting and its prevention by lubricant and oxide layers /

Fraser, Darren T. January 2000 (has links)
Thesis (Ph. D.)--University of Queensland, 2001. / Includes bibliographical references.

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