Global ETD Search

1	Solder paste inspection and 3D shape estimation using directional LED lightings Chu, Ming-hei. January 2007 (has links) Thesis (M. Phil.)--University of Hong Kong, 2008. / Also available in print. Solder pastes Surface mount technology.
2	Solder paste inspection and 3D shape estimation using directional LED lightings Chu, Ming-hei., 朱銘熙. January 2007 (has links) published_or_final_version / abstract / Electrical and Electronic Engineering / Master / Master of Philosophy Solder pastes - Testing. Surface mount technology.
3	Solder paste inspection based on phase shift profilometry Hui, Tak-wai., 許德唯. January 2007 (has links) published_or_final_version / abstract / Electrical and Electronic Engineering / Master / Master of Philosophy Printed circuits Surface mount technology Solder pastes. Engineering inspection.
4	Solder paste inspection based on phase shift profilometry Hui, Tak-wai. January 2007 (has links) Thesis (M. Phil.)--University of Hong Kong, 2008. / Also available in print.
5	Analysis of the solder paste release in fine pitch stencil printing processes Rodriguez, German Dario 08 1900 (has links) No description available. Solder pastes Screen process printing Surface mount technology Electronic packaging Testing
6	Reactive wetting and spreading in binary metallic systems Yin, Liang. January 2005 (has links) Thesis (Ph. D.)--State University of New York at Binghamton, Mechanical Engineering Department, 2005. / Includes bibliographical references (leaves 149-155).
7	Advanced process window design for 01005 assemblies Ramasubramanian, Arun Shrrivats. January 2008 (has links) Thesis (M.S.)--State University of New York at Binghamton, Department of Systems Science and Industrial Engineering, Thomas J. Watson School of Engineering and Applied Science, 2008. / Includes bibliographical references.
8	Thermal management of heat sensitive components in Pb-free assembly Raut, Rahul. January 2005 (has links) Thesis (M.S.)--State University of New York at Binghamton, Department of Systems Science & Industrial Engineering, 2005. / Includes bibliographical references.
9	Reduction of nitrogen consumption of lead-free reflow processes and prediction models for behaviors of lead-free assemblies Marquez de Tino, Ursula. January 2009 (has links) Thesis (Ph. D.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Systems Science and Industrial Engineering, 2009. / Includes bibliographical references.
10	Failure mechanism of lead-free Sn-Ag-Cu solder BGA interconnects Dhakal, Ramji. January 2005 (has links) Thesis (M.S.)--State University of New York at Binghamton, Department of Mechanical Engineering, 2005. / Includes bibliographical references (leaves 70-72).

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