Optical transceiver module plays an important role in the optical communication system. The packaging quality of the module decides the ability of the communication. Since the light signal is transferred from a laser diode to an optical fiber, the light transfer efficiency between these two components becomes a very important work to be done. The micrometer dimension and the ultra-high performance requirement of these components lead to many problems in module packaging process. Among all the problems, the packaging of the fiber components is the most complicated. In this research, many key technologies are proposed to solve or improve the problems in the packaging of the fiber components. Thus, the performance of the module can be ensured. Two main topics of the fiber component packaging will be introduced here, the fiber-solder-ferrule (FSF) packaging and the machining of the fiber. In the packaging of the FSF, a positioning and a soldering technology are proposed to improve the packaging yield. For the positioning, a novel control strategy is constructed to shorten the positioning time and improve the positioning accuracy. Thus, the position of the fiber can be positioned at the center of the ferrule fast and precisely. The controller successfully completes the positioning command in 0.25sec with 1µm accuracy. And finally, the coupling efficiency can be hold. For the soldering of the FSF, an active soldering mechanism is developed to replace the passive manual operation. The mechanism successfully proofs the stability of the soldering and raises the yield from the 25% to 83%. In machining of the fiber, a fiber end polishing issue and a fiber inspection topic are addressed. For the fiber end polishing, an online force sensing mechanism is implemented. The force sensing mechanism can control the polished fiber tip offset within 1.5µm. So the fiber coupling efficiency can be maintained. A control strategy is designed to solve the polishing problems and reach the polishing requirement. At last, an interference-based fiber inspection method is proposed to find the splicing plane between two spliced fibers. The accuracy of the fiber cleaving in a cascaded fiber fabrication improves from 10µm to 1µm by observing the fiber splicing plane precisely. All the improvements of the above packaging technologies are proposed to raise or keep the performance of the transceiver module. So, the error between theories and experiments can be minimized. Meanwhile, a high stability and repeatability of the packaging can be achieved due to the automation of the positioning, force sensing, and inspection.