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Strain analysis by digital image correlation /Hung, Po-Chih, January 1998 (has links)
Thesis (Ph. D.)--Lehigh University, 1999. / Includes vita. Bibliography: leaves 101-106.
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Strain measurement of flip-chip solder bumps using digital image correlation with optical microscopyLee, Dong Gun. January 2009 (has links)
Thesis (M.S.)--State University of New York at Binghamton, Thomas J. Watson School of Engineering and Applied Science, Department of Mechanical Engineering, 2009. / Includes bibliographical references.
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