The operation speed of power delivery system of packages has been upgraded to GHz. The instant current will pass to the power plane of the mother board by way of the IC pins and result in electromagnetic wave propagation between the power plane and the ground plane, then to produce the programs of electromagnetic interference. In this thesis, we will analyze the EMI of power delivery system of packages by finite-difference time-domain in two dimensions structure in three sections. In firist section, to computing EMI in finite-difference time-domain in two dimensions structure. In second section, to analyze more complicated power delivery plane, ex: EBG, in finite-difference time-domain in two dimensions structure. In three section, to add property of capacitors on power plane to reduce EMI in two dimensions structure. Above all, we hope to built a fast computing method to compute EMI to solve the time-consuming problems of full-wave simulated software. And to supply the engineer to deal with the similar problems in packages efficiently.