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Thermal conductivity enhancement in micro- and nano-particle suspensionsCherkasova, Anna S., January 2009 (has links)
Thesis (Ph. D.)--Rutgers University, 2009. / "Graduate Program in Mechanical and Aerospace Engineering." Includes bibliographical references (p. 83-89).
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Time-temperature curing relationship of an adhesive binder with rice straw a thesis /Ng, Kevin, Vanasupa, Linda. January 1900 (has links)
Thesis (M.S.)--California Polytechnic State University, 2010. / Title from PDF title page; viewed on February 18, 2010. Major professor: Linda Vanusupa, Ph.D. "Presented to the faculty of California Polytechnic State University, San Luis Obispo." "In partial fulfillment of the requirements for the degree [of] Master of Science in Engineering, with Specialization in Materials Engineering." "February 2010." Includes bibliographical references (p. 67).
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Thermal conductivity measurements of polyamide powderYuan, Mengqi 08 February 2012 (has links)
An important component in understanding the laser sintering process is knowledge of the thermal properties of the processed material. Thermal conductivity measurements of pure polyamide 12 and polyamide11 with multi-wall carbon nanotubes were conducted based on transient plane source technology using a Hot Disk® TPS500 conductivity measurement device. Polyamide powder was packed to three different densities in nitrogen at room temperature. Thermal diffusivity and conductivity were measured from 40°C to 170°C for both fresh powder and previously heated (“recycled”) powder. The fresh powder tests revealed that thermal conductivity increased linearly with temperature whereas for previously heated powder, more constant and higher thermal conductivity was observed as it formed a powder cake. Tests were also performed on fully dense polyamide 12 to establish a baseline. Polyamide 12 powder had a room-temperature thermal conductivity of approximately 0.1 W/mK which increased with temperature, whereas the bulk laser sintered polyamide 12 room-temperature value was 0.26 W/mK and generally decreased with increasing temperature. / text
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Heat transfer enhancement in nano-fluids suspensions : thermal wave effects and hyperbolic heat conduction.Vadasz, Johnathan J. January 2005 (has links)
The spectacular heat transfer enhancement revealed experimentally in nanofluids suspensions is being investigated theoretically at the macro-scale level aiming at explaining the possible mechanisms that lead to such impressive experimental results. In particular, the possibility that thermal wave effects via hyperbolic heat conduction could have been the source of the excessively improved effective thermal conductivity of the suspension is shown to provide a viable explanation although the investigation of alternative possibilities is needed prior to reaching an ultimate conclusion. / Thesis (M.Sc.Eng.)-University of KwaZulu-Natal, Durban, 2005.
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Development and Characterization of Thermally Conductive Polymeric Composites for Electronic Packaging ApplicationsChan, Ellen 05 December 2011 (has links)
Advancements in the semiconductor industry have lead to the miniaturization of components and increased power densities, resulting in thermal management issues. Due to this shift, finding multifunctional materials with excellent thermal conductivity and electrical resistivity are becoming increasingly important. For this research thesis, thermally conductive polymer composites were developed and characterized. In the first study, a LLDPE matrix was combined with hBN and SiC to determine the effects of both filler type and filler content. Novel porous composite materials were also fabricated to align thermally conductive fillers, improving k_eff while significantly reducing the overall weight. In the second study, PPS was used as a high performance matrix material and combined with different types of hBN to investigate the effects of size, shape, and aspect ratio on the composite, as well as the effect of hybrid fillers. The composites were characterized with respect to their physical, thermal, electrical, and mechanical properties.
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Development and Characterization of Thermally Conductive Polymeric Composites for Electronic Packaging ApplicationsChan, Ellen 05 December 2011 (has links)
Advancements in the semiconductor industry have lead to the miniaturization of components and increased power densities, resulting in thermal management issues. Due to this shift, finding multifunctional materials with excellent thermal conductivity and electrical resistivity are becoming increasingly important. For this research thesis, thermally conductive polymer composites were developed and characterized. In the first study, a LLDPE matrix was combined with hBN and SiC to determine the effects of both filler type and filler content. Novel porous composite materials were also fabricated to align thermally conductive fillers, improving k_eff while significantly reducing the overall weight. In the second study, PPS was used as a high performance matrix material and combined with different types of hBN to investigate the effects of size, shape, and aspect ratio on the composite, as well as the effect of hybrid fillers. The composites were characterized with respect to their physical, thermal, electrical, and mechanical properties.
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A two dimensional fluid dynamics solver for use in multiphysics simulations of gas cooled reactorsLockwood, Brian Alan January 2007 (has links)
Thesis (M. S.)--Mechanical Engineering, Georgia Institute of Technology, 2008. / Committee Co-Chair: de Oliveira, Cassiano; Committee Co-Chair: Ghiaasiaan, S. Mostafa; Committee Member: Martineau, Richard C.; Committee Member: van Rooijen, W.F.G
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Heat transfer in nuclear fuels measurements of gap conductance /Cho, Chun Hyung, January 2004 (has links)
Thesis (Ph. D.)--University of Missouri-Columbia, 2004. / Typescript. Vita. Includes bibliographical references (leaves 95-99). Also available on the Internet.
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Heat transfer in nuclear fuels : measurements of gap conductance /Cho, Chun Hyung, January 2004 (has links)
Thesis (Ph. D.)--University of Missouri-Columbia, 2004. / Typescript. Vita. Includes bibliographical references (leaves 95-99). Also available on the Internet.
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Analysis and optimization of electroformed dendritic structures as enhanced heat transfer surfacesCampbell, Michael, Ma, Hongbin, January 2009 (has links)
The entire thesis text is included in the research.pdf file; the official abstract appears in the short.pdf file; a non-technical public abstract appears in the public.pdf file. Title from PDF of title page (University of Missouri--Columbia, viewed on October 21, 2009). Thesis advisor: Dr. Hongbin Ma. Includes bibliographical references.
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