The objective of this investigation was to develop micro/nano-scale temperature sensors for measuring surface temperature transients in multi-phase flows and heat transfer. Surface temperature fluctuations were measured on substrates exposed to phase change processes. Prior reports in the literature indicate that these miniature scale surface temperature fluctuations can result in 60-90 percent of the total heat flux during phase change heat transfer. In this study, DTS (Diode Temperature Sensors) were fabricated with a doping depth of ~100 nm on n-type silicon to measure the surface temperature transients on a substrate exposed to droplet impingement cooling. DTS are expected to have better sensor characteristics compared to TFTs (Thin Film Thermocouples), due to their small size and faster response (which comes at the expense of the smaller operating temperature range). Additional advantages of DTS include the availability of robust commercial micro fabrication processes (with diode and transistor node sizes currently in the size range of ~ 30 nm), and that only 2N wire leads can be used to interrogate a set of N x N array of sensors (in contrast thermocouples require 2 N x N wire leads for N x N sensor array). The DTS array was fabricated using conventional semi-conductor processes. The temperature response of the TFT and DTS was also calibrated using NIST standards. Transient temperature response of the DTS was recorded using droplet impingement cooling experiments. The droplet impingement cooling experiments were performed for two different test fluids (acetone and ethanol). An infrared camera was used to verify the surface temperature of the substrate and compare these measurements with the temperature values recorded by individual DTS. PVD (Physical Vapor Deposition) was used for obtaining the catalyst coatings for subsequent CNT synthesis using CVD (Chemical Vapor Deposition) as well as for fabricating the thin film thermocouple (TFT) arrays using the "lift-off" process. Flow boiling experiments were conducted for three different substrates. Flow boiling experiments on bare silicon wafer surface were treated as the control experiment, and the results were compared with that of CNT (Carbon Nano-Tube) coated silicon wafer surfaces. Similar experiments were also performed on a pure copper surface. In addition, experiments were performed using compact condensers. Micro-scale patterns fabricated on the refrigerant side of the compact heat exchanger were observed to cause significant enhancement of the condensation heat transfer coefficient.

The first study researched turbulent forced convective heat (mass) transfer down- stream of blockages with round and elongated holes in a rectangular channel. The blockages and the channel had the same cross section, and a distance equal to twice the channel height separated consecutive blockages. Naphthalene sublimation experiments were conducted with four hole aspect ratios (hole-width-to-height ratios) and two hole-to-blockage area ratios (ratios of total hole cross-sectional area to blockage area). The effects of the hole aspect ratio, for each hole-to-blockage area ratio, on the local heat (mass) transfer distribution on the exposed primary channel wall between consecutive blockages were examined. Results showed that the blockages with holes enhanced the average heat (mass) transfer by up to 8.5 and 7.0 times that for fully developed turbulent flow through a smooth channel at the same mass flow rate, respectively, in the smaller and larger hole-to-blockage area ratio (or smaller and larger hole diameter) cases. The elongated holes caused a higher average heat (mass) transfer and a larger spanwise variation of the local heat (mass) transfer on the channel wall than did the round holes. The second study explored the heat transfer enhancement for pool boiling on nano-structured surfaces. Experiments were conducted with three horizontal silicon surfaces, two of which were coated with vertically aligned multi-walled carbon nanotubes (MWCNT) with heights of 9 and 25 ¹m, respectively, and diameters between 8 and 15 nm. The MWCNT arrays were synthesized on the two silicon wafers using chemical vapor deposition. Experimental results were obtained over the nucleate boiling and film boiling regimes under saturated and sub-cooled (5±C and 10±C) boiling conditions. PF-5060 was the test fluid. Results showed that the MWCNT array with a height of 25 ¹m enhanced the nucleate and film boiling heat fluxes on the silicon surface by up to 380% and 60%, respectively, under saturated boiling conditions, and by up to 300% and 80%, respectively, under 10±C sub-cooled boiling conditions, over corresponding heat fluxes on a smooth silicon surface. The MWCNT array with a height of 9 ¹m enhanced the nucleate boiling heat flux as much as the taller array, but did not significantly enhance the wall heat flux in the film boiling regime.