Semiconductor die attach materials for high voltage, high reliability analog devices require high thermal conductivity and retention of dielectric strength. A comparative study of effective thermal conductivity and dielectric strength of selected thermoset/ceramic composites was conducted to determine the effect of ceramic particle size and ceramic particle loading on thermoset polymers. The polymer chosen for this study is bismaleimide, a common aerospace material chosen for its strength and thermal stability. The reinforcing material chosen for this study is a ceramic, hexagonal boron nitride. Thermal conductivity and dielectric breakdown strength are measured in low and high concentrations of hexagonal boron nitride. Adhesive fracture toughness of the composite is evaluated on copper to determine the composite’s adhesive qualities. SEM imaging of composite cross-sections is used to visualize particle orientation within the matrix. Micro-indentation is used to measure mechanical properties of the composites which display increased mechanical performance in loading beyond the percolation threshold of the material. Thermal conductivity of the base polymer increases by a factor of 50 in 80%wt loading of 50µm hBN accompanied by a 10% increase in composite dielectric strength. A relationship between particle size and effective thermal conductivity is established through comparison of experimental data with an empirical model of effective thermal conductivity of composite materials.