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This paper presents a novel active-alignment technique to fabricate one-dimensional optical fiber array. The advantages of this technique are providing simple structure on silicon- based optoelctronic device and individually adjusting relative position error of fiber array and laser diode array. The way to adjust fiber displacement is applying electric force to pull the adhesive which used to fix fibers and microholders. Then the adhesive has adhesive force with fiber surface that bring fiber moving away from its original position. The method has to consider some issues including choosing the adhesive viscosity, controlling adhesive volume in the microholder, confirming adjusting precision of fiber displacement, compensating the fiber Offset after curing. So we can obtain the minimum adjusting precision 0.5£gm and control the fiber traveling distance at ¡Ó0.4£gm. The way to improve those issues of adjusting the fiber array to achieve the best coupling position is described in this paper.

Abstract For the requirements of high-speed signal transmission has been increasing in the optical communication system ,so the fiber array in the communication system has a lot of advantages which can not be replaced. But the loss of coupling efficiency is a difficult problem as the distance of communication is getting longer and longer. The packaging quality of the fiber array module. In order to increase the transmission and the coupling efficiency, we produce the high precision to reach the goal. This paper use adhesive bonding technology to packageing of the fiber array module. But the adhesive had shrinkage and strength two problem. This paper presents a novel height and strength control strategy is constructed to fabricate one-dimensional optical fiber array. For the height,a active-alignment technique is used and shrinkage control and pick adhesive parameter can improve accuracy to displacement distance is below 1£gm in the work tempeture.For the strength of the adhesion¡Aa way to use different kind temperature in the work can add adhesion's strength. After work use to replace temperature in order to add strength. All the improvements of the above packading technologies are proposed to raise or keep the performance of the fiber array module.So,the error between theories and experiments can be minimized.Meanwhile,a high stability and repeatability of the packaging can be achieved due to the automation of the positioning force sensing,andinspection.

Thesis (Ph. D.)--Lehigh University, 2002. / Includes bibliographical references and vita.

Thesis (M.S.)--West Virginia University, 2004. / Title from document title page. Document formatted into pages; contains x, 56 p. : ill. (some col.). Includes abstract. Includes bibliographical references (p. 52-53).

published_or_final_version / Industrial and Manufacturing Systems Engineering / Master / Master of Philosophy

The objectives of the thesis were to investigate the adhesives influence on the mechanical properties in laminated multi-layer paperboard. The study also strived to find a method to investigate the interface strength of the adhesive layer. This was investigated by constructing handsheets of laminated paperboard by gluing a bulky, CTMP center ply, Chromofoil, of two different grammages, 290 g/m2 and 360 g/m2, together with two outer plies of ordinary copy paper, Multi- Copy 80 g/m2. The sheets were glued with two types of dispersion adhesives, a starch based adhesive and a polyvinyl acetate based adhesive. Twelve types of test specimens were constructed and tested in a series of mechanical tests, which involved a tensile test, a two-point bending test and a Scott Bond test. The method called “digital image correlation” was used trying to investigate the interface strength of the adhesive layer. The study also involved an evaluation of the possibility to predict the bending stiffness of laminated multi-layer paperboard by using calculations according to classic laminate theory. The results show that it is fully possible to use these calculated values as a prediction, with low risk of overestimating the bending stiffness of the paperboard and without involving the adhesive layer in the calculation. The method provided high absolute values in bending and tensile properties, which increased with increasing amount of glue applied. This came at the cost of grammage, which lead to low index values. The overall conclusion is that the effect from the adhesives is somewhat negative, since the mechanical properties would have been improved if the adhesive had been replaced with more fiber. The major source of errors during the experiments was the roughness of the manufacturing method. This lead to an uncertainty about whether the right amount of adhesive had been applied to the test specimens. Due to this the validity of the results could be questioned. Digital image correlation proved to be a rather sensitive method that requires a high accuracy setup and execution for it to be applicable in this type of study. The failure mode of the glue seam correlated well to the amount of glue applied. A lower amount of adhesive applied increases the likeliness of failure of the glue seam.

Thesis (M.Eng.)--University of South Australia, 1995.

Thesis (M.S.)--Virginia Polytechnic Institute and State University, 1992. / Vita. Abstract. Includes bibliographical references (leaves 145-152). Also available via the Internet.

Thesis (Ph. D.)--Ohio State University, 2000. / Includes vita. Title from title page display. Abstract. Advisor: M.-H. Herman Shen, Dept. of Aerospace Engineering, Applied Mechanics, and Aviation. Includes bibliographical references (p. 152-154).