Urea formaldehyde (UF) resins are widely used as adhesives for wood-based composites. These thermosetting polymers have advantages of relative low price, fast curing speed, and relative good bonding performance. However, UF resin bonded composites are designed for interior applications due to its weak water resistance. Moreover, traditional prevalent ways for recycling wood-based composites face problems caused by UF resins. In this project, the reuse of cured UF resins was systematically studied. The verification and characterization of crystalline structures in cured UF resins were conducted. The results showed that the crystalline regions were accounted for nearly 14.48% in a typical 1.2 formaldehyde to urea (F/U) molar ratio UF resin. The details of the resin crystalline regions, such as grain sizes and interplanar spacing (d-spacing), were characterized. The crystalline structures, nevertheless, did not affect the UF resin hydrothermal hydrolysis in this study. The reuse of cured UF resin was started with a hydrothermal hydrolysis. Under 140 °C and 2 h of hydrothermal process, 20 mL of 30 w.t. % formaldehyde water solution was able to depolymerize up to 1.7 g of cured UF resin. The hydrolyzed formaldehyde solutions were directly used as normal formaldehyde solutions for UF resin synthesis. The synthesized resin (named as UUF resin) contained about 6 w.t. % of cured UF resin and presented similar chemical structures and bonding performance as normal UF resins. Hybrid resins made of UUF resin and polymeric 4-4 diphenyl methane diisocyanate (pMDI) were prepared. The pMDI was found evenly dispersed in the hybrid resins by using acetone as its solvent. These hybrid resins resulted in faster curing and stronger bonding performance than pure UUF resins. Furthermore, the hybrid resin was used in a new bonding design, which used southern pine wood radial section features. This design generated finger joint like bonding interfaces by hot pressing two resin coated wood radial sections. The bonding strength and bond line stability were enhanced by this design.

A cold atmospheric pressure plasma source was investigated as an alternative pre-treatment for carbon fibre reinforced epoxy substrates prior to bonding. For reference, common surface pre-treatments were also investigated (peel ply, manual abrasion, and grit blasting). In the aerospace industry, the peel ply, is usually added to one side of the composite surface during manufacture and peeled off prior to bonding. Peel ply can be used independently or in combination with other techniques. The strength of the bonded joints of the different pre-treatments was assessed through tensile lap shear tests. It was found that combining peel ply with plasma increased the joint strength by 10% whereas manual abrasion or grit blasting after peel ply improved the strength of the joints by 15% and 20% respectively. The effect of pre-treating the composite substrate side without peel ply (bag side) was also investigated. The strength of the joints produced without any pre-treatment was increased by 99% for manual abrasion, 134% for grit blasting and by 146% for plasma. Comparing both surfaces of the composite substrates, it was found that using peel ply improved the performance of the joints by 91%. In order to understand better the effects of the different pre-treatments, surface characterisation of the substrates (surface roughness, surface free energy, and analysis of chemical changes) was also conducted. The effect of roughness did little to affect the strength values (for both surfaces of the composite). The adhesive used in this research was very good at wetting the surface, regardless of the roughness. However, when the adhesive was able to wet the surface, the relationship between bond strength and surface free energy was unclear. Plasma was shown to increase levels of oxygen at the surface and reduce/eliminate the concentration of fluorine at the surface on the bag side of the composite.

The low-temperature joining technique (LTJT) by silver sintering is being implemented by major manufacturers of power electronics devices and modules for bonding power semiconductor chips. A common die-attach material used with LTJT is a silver paste consisting of silver powder (micron- or nano-size particles) mixed in organic solvent and binder formulation. It is believed that the drying of the paste during the bonding process plays a critical role in determining the quality of the sintered bond-line. In this study, a model based on the diffusion of solvent molecules and viscous mechanics of the paste was introduced to determine the stress and strain states of the silver bond-line. A numerical simulation algorithm of the model was developed and coded in the C++ programming language. The numerical simulation allows determination of the time-dependent physical properties of the silver bond-line as the paste is being dried with a heating profile. The properties studied were solvent concentration, weight loss, shrinkage, stress, and strain. The stress is the cause of cracks in the bond-line and bond-line delamination. The simulated results were verified by complementary experiments in which the formation of cracks in bond-line and interface delamination was observed during the pressure-free drying of a die-attach nanosilver paste. Furthermore, the important drying parameters, such as drying pressure, low temperature drying time and temperature ramp rate of nanosilver LTJT process, are experimentally studied and analyzed with the numerical simulation. The simulated results were consistent with the experimental findings that the quality of sintered silver bond-line increases with increasing external drying pressure, with increasing low temperature drying time, and with decreasing temperature ramp rate. The insight offered by this modeling study can be used to optimize the process profile that enable pressure-free, low-temperature sintering of the die-attach material to significantly lower the cost of implementing the LTJT in manufacturing. / Ph. D.