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The influence of copper on the rate of solution of iron in acidsBell, Frederick Keller, January 1920 (has links)
Thesis (Ph. D.)--John Hopkins University, 1920. / Biography.
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Příprava vodivých struktur bezproudovým pokovením vytištěného prekurzoru / Fabrication of conducting patterns by material electroless plating of printed precursorKováčová, Silvia January 2021 (has links)
The subject of this diploma thesis is the preparation of conductive structures by electroless plating of an extruded precursor. The experimental part deals with the preparation of standard patterns based on the length of immersion time in a coppering bath. The precursor layers were applied with Fujifilm Dimatix to various receiver substrates. The individual substrates with the precursor layer were immersed in the copper solution within different time intervals. The structure of the layers of grown copper and their thickness was characterized by a profilometer.
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Bacterial Inhibition in Waste-Water/Fracking Water Using Copper Ion SolutionNeupane, Kamal 23 May 2016 (has links)
No description available.
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