Due to the multi-tasking and miniaturization of electronic devices, faster heat transfer is required from the device to avoid the thermal failure. Die-attached polymer adhesives are used to bond the chips in electronic packaging. These adhesives have to hold strong mechanical, thermal, dielectric, and moisture resistant properties. As polymers are insulators, heat conductive particles are inserted in it to enhance the thermal flow with an attention that there would be no electrical conductivity as well as no reduction in dielectric strength. This thesis focuses on the characterization of polymer nanocomposites for thermal and electrical properties with experimental and computational tools. Platelet geometry of hexagonal boron nitride offers highly anisotropic properties. Therefore, their alignment and degree of orientation offers tunable properties in polymer nanocomposites for thermal, electrical, and mechanical properties. This thesis intends to model the anisotropic behavior of thermal and dielectric properties using finite element and molecular dynamics simulations as well as experimental validation.