• Refine Query
  • Source
  • Publication year
  • to
  • Language
  • 34
  • 11
  • 10
  • 2
  • 1
  • 1
  • 1
  • Tagged with
  • 72
  • 72
  • 48
  • 10
  • 7
  • 7
  • 7
  • 6
  • 6
  • 6
  • 6
  • 6
  • 5
  • 5
  • 5
  • About
  • The Global ETD Search service is a free service for researchers to find electronic theses and dissertations. This service is provided by the Networked Digital Library of Theses and Dissertations.
    Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
71

Probe Modules for Wafer-Level Testing of Gigascale Chips with Electrical and Optical I/O Interconnects

Thacker, Hiren Dilipkumar 10 July 2006 (has links)
The use of optical input/output (I/O) interconnects, in addition to electrical I/Os, is a promising approach for achieving high-bandwidth, chip-to-board communications required for future high-performance gigascale chip-based systems. While numerous efforts are underway to investigate the integration of optoelectronics and silicon microelectronics, virtually no work has been reported relating to testing of such chips. The objective of this research is to explore methods that enable wafer-level testing of gigascale chips having electrical and optical I/O interconnects. A major challenge in achieving this is to develop probe modules which would allow high-precision, temporary interconnection of a multitude of electrical and optical I/Os, in a chip-size area, to automated test equipment. A probe module would need to do this in a rapid, step-and-repeat manner across all the chips on the wafer. In this work, two candidate probe modules were devised, batch-fabricated on Si using microfabrication techniques, and successfully demonstrated. The first probe module consists of compliant electrical probes (10^3 probes/cm^2) fabricated alongside grating-in-waveguide optical probes. The second module consists of micro-opto-electro-mechanical-systems (MOEMS)-based microsocket probes (10^4 probes/cm^2) to interface a chip with polymer pillar-based electrical and optical I/Os. High-density through-wafer interconnects are an essential attribute in both probe substrates for transferring electrical and optical signals to the substrate back-side. Fabrication and characterization of metal-clad, metal-filled, and polymer-filled through-wafer interconnects as well as process integration with probe substrate fabrication are described and numerous possible redistribution schemes are explicated. Chips with optical and electrical I/Os are an emerging technology, and one that test engineers are likely to encounter in the near future. The contributions of this thesis are to help understand and address the issues relating to joint electrical and optical testing during manufacturing.
72

La composition d’œuvres mixtes prenant comme modèle la musique électroacoustique

Lecours, Pierre-Luc 04 1900 (has links)
Cette version du mémoire a été tronquée des éléments audio et vidéo des compositions originales. Une version plus complète est disponible en ligne pour les membres de la communauté de l’Université de Montréal et peut aussi être consultée dans une des bibliothèques UdeM. / Le projet de recherche-création présenté dans ce mémoire comporte la mise en contexte et l’analyse d’une série d’œuvres musicales originales pouvant être jouées en concert par un ensemble de musiciens (instrumentistes, manipulateurs d’objets et interprète de synthèse sonore) créée en utilisant une approche de composition basée sur la musique électroacoustique. Cette recherche-création a exploré les enjeux créatifs et esthétiques de la fusion de deux approches de composition (mixte et électroacoustique), ainsi que du changement de médium (de support fixe à la performance). Se basant sur les théories d’analyse et d’écriture de la musique électroacoustique (Schaeffer, Roy, Vande Gorne) et de la musique mixte (Dall'Ara-Majek, Doneux) - quatre œuvres ont été composées (Éclats | Violet, Imaginary Landscape, Éclats | Noir et interference patterns), proposant un éclairage pratique à ces outils de composition. L’écriture de partitions pour instruments ou dispositifs électroniques est aussi abordée à partir d’exemples et d’articles sur le sujet. / The research-creation project presented in this dissertation presents the context and the analysis of a series of original musical works that can be played in concert by a group of musicians (instrumentalists, manipulators of objects and sound synthesis interpret) created using a composition approach based on electroacoustic music. This research-creation explored the creative and aesthetic challenges of merging two compositional approaches (mixed and electroacoustic), as well as the change of medium (from fixed support to performance). Based on theories of analysis and writing of electroacoustic music (Schaeffer, Roy, Vande Gorne) and mixed music (Dall'Ara-Majek, Doneux) - four works have been composed (Éclats | Violet, Imaginary Landscape, Éclats | Noir and interference patterns) providing practical lighting for these composition tools. The writing of scores for electronic instruments or devices is also approached from examples and articles on the subject.

Page generated in 0.115 seconds