- About
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The Global ETD Search service is a free service for researchers
to find electronic theses and dissertations. This service is
provided by the
Networked Digital Library of Theses and Dissertations.
Our metadata is collected from universities around the world. If you manage a university/consortium/country archive and want to be added, details can be found on the NDLTD website.
Search results
Showing 1 to 10 of 137 (0.047 seconds)| 1 |
Mechanical properties of aluminum-filled epoxiesShinde, Sham Ambaji, 1942- January 1971 (has links)
No description available.
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A correlation between morphology and fracture properties of epoxy resinsMijović, Jovan S., January 1978 (has links)
Thesis--University of Wisconsin--Madison. / Typescript. Vita. eContent provider-neutral record in process. Description based on print version record. Includes bibliographical references (leaves 244-274).
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Properties of epoxy resin joints in masonry materialsMartinez-Pereda, Pedro. January 1962 (has links)
Thesis (M.S.)--University of Wisconsin--Madison, 1962. / Typescript. eContent provider-neutral record in process. Description based on print version record. Includes bibliographical references (leaves 65).
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Effects of processing and environmental conditions on the properties of epoxy materialsOttemer, Xavier 05 1900 (has links)
No description available.
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Miscibility predictions in polymer blendsMilner, V. A. January 1992 (has links)
No description available.
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Cure behavior of epoxy polymers used in microelectronics /Taweeplengsangsuke, Jantrawan, January 2000 (has links)
Thesis (Ph. D.)--Lehigh University, 2000. / Includes vita. Includes bibliographical references (leaves 220-231).
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Understanding the strength of epoxy-polyimide interfaces /Hoontrakul, Pat January 2003 (has links)
Thesis (Ph. D.)--Lehigh University, 2003. / Includes bibliographical references and vita.
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The use of epoxy resin compounds as a shear connector in composite beam constructionAnkeny, Robert Allen, 1942- January 1966 (has links)
No description available.
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| 9 |
Correlation between the dielectric, rheological and structural properties of DGEBA-DDS epoxyRatnam, Mamatha D. 08 1900 (has links)
No description available.
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| 10 |
Thermoelastic stress analysis for an encapsulated silicon chip interfaceShepherd, Russell D. 05 1900 (has links)
No description available.
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