In this thesis, the contact behavior of the conduct particles in the anisotropic conductive film (ACF) packaging process is investigated. The thermal elastic-plastic finite element (FE) model is employed to simulate the contact process. The commercial MARC finite element method package is used in this work. Two contact models of the ACF packaging are studied : the single particle and the multiple-particles models. In the single particle model a simple axial symmetric FE model is used to simulate the variation of elastic-plastic deformations during packaging process. The effect of coating thickness on the contact deformation is discussed. To explore the effect of particle distribution on the contact deformation and the conduct behavior in the ACF packaging, the multiple-particles 3D model has also been studied. However, to overcome the computing difficulties introduced from huge degrees of freedom, the equivalent nonlinear springs are employed to stand for some conductive particles. The effect of particle distribution and particle parameters on the conductive behavior are studied. Results indicate that the conductive particle parameters may affect the conductive characteristics significantly in the ACF packaging process.