No description available.

No description available.

No description available.

No description available.

No description available.

No description available.

Abstract In this thesis, we have studied the post-weld-shift (PWS) in laser welding technique for laser module packaging. The joining method for packaging of laser module by laser welding technique can offer a number of significant advantages. It provides strong joint strength, therefore, the packaging has good long-term stability. It also provides high-speed and high-volume production, and hence the packaging is potential low cost. However, the laser welding process has caused PWS of laser module, would decay the coupling efficiency of laser module. We investigate the weld-spot by using metallographic method. The PWS in stainless steel (SS304L) plate is studied experimentally and numerically. The metallographic results are in good agreement with the Finite-Element-Method (FEM) results that the PWS in x-y plane can be neglected. Based on the experimentally and numerically results of PWS in SS304L, we investigate the yield improvement of laser module packaging. The laser hammer technique was used to improve the coupling efficiency of laser module. The results show displacement of the z-axis is from 1 to 9 (£gm) that equals to the angle changes of upper parts of laser module from 0.38¡Ñ10-2 to 3.4¡Ñ10-2 (degree). Therefore, the coupling efficiency of laser module can be improved from 4 to 20 (%).

In the proposed project¡Athe three - dimensional vibration of circular and annular plates is analyzed by a mixed finite element¡C Stresses¡Aas well as displacements¡A are primary variables in the mixed finite element formulation¡Atherefore¡Aall the stress and displacement boundary conditions can be imposed exactly¡CMeanwhile¡Athe proposed finite element is a modification of axisymmetric finite element which is based on three ¡V dimensional elasticity¡Aso general results of both axisymmetric and unaxisymmetric vibration of circular and annular plates can be obtained¡C Results of the present project will be compared to those by conventional displacement ¡V type finite element¡ARitz method and series method to show the difference among these theories¡CEspecially¡Athe effect of satisfying the stress boundary conditions on the unaxisymmetric vibration analyses can be demonstrated¡Awhich is not available in the literature up to date¡C

ABSTRACT In the present study, it is emphasized that mixed-type finite element formulation, which is different from the conventional displacement-type formulation, has both displacements and stresses as its primary variables. Therefore, stress, as well as displacement boundary conditions, can be imposed easily and exactly. Except around the outer edge where support is placed, stresses obtained by both displacement and mixed formulation are close to each other when the circular plate is subject to transverse uniform loading. However, large discrepancies exist around the locations of constraints, where the stresses are always significant and critical. Since mixed formulation of the present study can completely satisfy the stress and displacement boundary conditions, it can theoretically provide more accurate stress analysis and should be considered as a more appropriate analysis tool.

This study aims to investigate the thermal fatigue life of the solder ball.Generally, the fatigue of the solder ball results from thermal cyclic loading in different thermal expansion coefficiency of the material in the IC package. To analyze the equivalent stress and the equivalent strain distributions of the solder ball under loading, an analysis software ANSYS was adopted in this study. To stimulate viscoplastic (creep and plastic) property of the solder ball, the Anand model was adopted. From the modified Coffin-Manson equation and the viscoplastic strain range, the fatigue life of the solder ball was obtained finally. The causes of the fatigue life of the solder ball in this study were attributed to many factors, such as the solider ball¡¦s geometry, substrate thickness, different material properties, change of pad diameter, etc. Finally, the researcher found the increasing solder joint reliability methods and supplied the improving solder joint data for the design engineer.